V310i: The Advanced 3D Solder Paste Inspection System for Your Inspection Needs

The advanced solder paste inspection (API) plays an essential role in guaranteeing the quality and quantity of the solder paste printing in the SMT line.

Posted on May 31, 2020

The advanced solder paste inspection (API) plays an essential role in guaranteeing the quality and quantity of the solder paste printing in the SMT line. Solder paste printing is a complicated process and contributes to defects from many factors. It depends on the volume of particle balls deposited on the pads to achieve a good product.

In order to cover all types of solder paste and solder balls as the sizes are getting smaller and smaller, the vision resolution of inspection becomes challenging! Therefore, ViTrox provides customers with V310i Advanced 3D Solder Paste Inspection System (API) to offer variable fine lens preparing for customer selection based on their products to measure pads of solder deposit. The accuracy of 3D measurement on Area, Volume, Height able to reduce the rework cost and achieve a high-quality product.

To cover your needs, we offer various solder paste inspection platforms such as V310i 3D standard, V310i 3DXXL & V310i XL. V310i XL is a BRAND NEW platform. This platform is suitable to serve major board industries such as communication, consumer electronics, automotive, medical industries with the capability of handling board weight up to 7kg and 510mm x 510mm board size for Single Lane or 460mm x 325mm for Dual Lane. The 95% of API parts are similar to V510i AOI. Therefore, AOI and API are able to share the same wear and tear spare parts to reduce the investment cost.

If you are interested in our V310i Advanced 3D Solder Paste Inspection System (API) and would like to learn more, feel free to make enquiries and consult with our experts at Here