V310i Advanced 3D Solder Paste Inspection (API/SPI)
Improper solder paste printing is one of the reasons for generating defects in the printed circuit board. ViTrox’s Advanced 3D Solder Paste Inspection Solution (API/SPI) is designed for a complete inspection of solder paste deposition during printing to secure product quality. It helps users achieve cost-effectiveness by detecting faults in the solder printing stage of the production line and improving productivity.
Explore the key benefits of ViTrox's latest Advanced 3D Solder Paste Inspection Solution.
New Graphic User Interface (GUI)
The new GUI brings a new look for the user in dark or light themes. The flexibility of using the software in either theme reduces strain on the user’s eyes. In addition, users can increase the productivity of data mining and presentation through the new user-friendly interface. Not forgetting, the parameter editor is now easier to access than before. By using the visual guide, your workflow will now be optimized and made even more efficient in helping to ensure the inspection's quality, accuracy, and consistency of users' experience with optimal algorithms and programming.
For Illustration Purpose: Light theme (left), Dark theme (right)
Capable to Inspect 510mm x 540mm Board Size
The latest API Solution can inspect larger board sizes up to 510mm x 540mm. It is suitable for most industries requiring board inspection, such as communication, consumer electronics, automotive, and medical industries.
Low Cost of Ownership
Up to 95% of the spare parts of API are compatible with ViTrox’s V510i Advanced 3D Optical Inspection (AOI) machine, allowing both systems to share the wear and tear spare parts. The compatibility between both machines would greatly help to reduce the investment cost.
Talk to us now to explore your ideal solder paste inspection solution to minimize the risk of a false call rate and maximize your productivity at the same time!