ViTrox Technologies today announced that it will exhibit at Hall 1, Booth #1C20 at 2017 NEPCON South China, scheduled to take place 29-31 August, 2017 at Shenzhen Convention & Exhibition Center.
ViTrox is going to exhibit the award-winning and also one of the best-selling products - V510i Optimus 3D AOI. V510i 3D AOI is now enhanced with 12 Megapixels camera which guarantees high inspection quality and resolution. The inspection speed has been enhanced to 60cm²/sec and resolution is increased to 15?m. It uses 2D + 3D Inspection concurrently to achieve high productivity and high detectability. Challenging defects such as Lifted Lead, Coplanarity, Black color PCB / Multicolor PCB, Presence / Absence and small components like 01005/ 0201 and many others can be detected. It is available with Flexible Dual Lane configurations and also XXL model to cater for larger boards inspection.
Besides, another showcase product is the hot-selling, Advanced 3D X-ray inspection system, V810i S2EX. V810i S2EX inspects boards up to 482 x 609mm which is 10 percent larger! It provides the best support on the market for boards up to 7mm thick and weight up to 4.5kg. The inspection area of the system is improved to 18.7’’ x 24’’. V810i S2EX’s highlighted key features are Scan Path Merging (SPAM) which can reduce the inspection time and hardware scanning path, Single Unified Management Office (SUMO) which uses 8-core processor with 128GB of RAM that accelerates the system to its optimum level of performance, Simultaneous Efficient Reconstruction Technique (SERT) and a new 64bit imaging processor architecture combine Predictive Slice Height (PSH) into a single scanning path, Phase Shift Profilometry 2 (PSP 2) which boosts the projection and image acquisition speed up to 10 times faster using an in-house proprietary projector. PSP 2 improves accuracy and test coverage on 100 percent pressfit and PTH boards.
ViTrox's V310i 3D SPI system inspects PCB boards up to 510mm x 505mm. It can accurately detect solder paste related defects in high-speed mode. The Programmable Spatial Light Modulation (PSLM) of V310i 3D SPI eliminates the mechanical operation and moving parts, greatly improving the ease of use and reliability, and reducing the maintenance costs compared to other solder paste inspection technologies available in the market. The patented D-Lighting achieves full light spectrum detectability, which aims to solve the shadow effect and reduce noise interference during 3D measurement.
ViTrox's V-ONE is the new solution-based product recently launched that combines all of the previous and future ViTrox software into one suite of solutions to connect the inspection machines in SMT production lines in order to monitor their performance on a real-time basis. V-ONE allows users to manage factories smarter and optimize factory resources across geographical locations.
Additionally, ViTrox will display TH1000i tray-based vision handler which is catered for back-end semiconductor inspection. TH1000Si is designed with advanced key technologies to provide high speed, high accuracy, one stop vision inspection solutions specially for BGA, QFN, CSP, TSSOP, MSOP, SOP IC packages handled in tray. TH1000Si's 16 pick up heads contribute to high throughput of up to 42K UPH. Auto pitching mechanism provides faster and more reliable nozzle pitch conversion.
ViTrox's field experts will be available throughout show days to assist for any inquiry and they are welcoming you to enjoy the live demonstration of our products. Please do not miss this golden opportunity to experience the latest technology from ViTrox!
sourced from: EMSNow
