PENANG, MALAYSIA – March 2026 – ViTrox, which aims to be the World’s Most Trusted Technology Company in providing innovative, advanced, and cost-effective automated Machine Vision Inspection Solutions for the semiconductor and electronics packaging industries, proudly announces that its latest V810Ai QX1 Smart 3D X-ray Inspection (AXI) System has been honoured with the 2026 Circuits Assembly New Product Introduction (NPI) Award in the Test and Inspection – AXI category.
This achievement underscores ViTrox’s commitment to delivering advanced inspection solutions that address the increasing complexity of high-density assemblies and advanced semiconductor packaging.
V810Ai QX1 Smart 3D X-ray Inspection (AXI) System
The V810Ai QX1 AXI is an AI-powered Smart 3D AXI system engineered for ultra-high-resolution imaging of up to 2µm, enabling reliable detection of micro-defects in advanced packaging applications such as Flip Chip and System-in-Package (SiP). Beyond semiconductor packaging, the system also delivers exceptional performance in SMT inspection, particularly in challenging scenarios involving heavily shaded or complex components, ensuring consistent defect detection and superior inspection quality. Its wide tomography angle of up to 50° further enhances defect detection accuracy, especially for Head-in-Pillow (HiP) defects. Powered by proprietary SmartTone imaging and advanced 3D Computed Tomography (3DCT), it delivers precise inspection of critical defects in heavily shaded and challenging inspection scenarios while ensuring accurate reconstruction of complex internal structures.
Equipped with AI-driven solutions, the system optimises programming, defect detection, and verification, reducing manual dependency while improving consistency, throughput, and overall efficiency. With Advanced Planar CT for dual-sided PCB inspection and a high-speed precision imaging architecture capable of detecting defects down to 10µm, the V810Ai QX1 AXI supports the full production lifecycle—from NPI to volume manufacturing—while ensuring seamless integration into smart factory environments via SMEMA and HERMES protocols.
“The V810Ai QX1 AXI reflects ViTrox’s commitment to pushing the boundaries of inspection technology through AI and advanced imaging. By combining ultra-high-resolution capabilities with intelligent automation, we empower manufacturers to achieve higher accuracy, improved productivity, and greater confidence in addressing the challenges of next-generation electronics manufacturing,” said Lee Sung Way, R&D Director of ViTrox Technologies.
Explore the capabilities of ViTrox’s award-winning solutions. To schedule a demonstration or learn more, contact us at enquiry@vitrox.com.
