Unveiling Next-Level Solder Paste Inspection for Smarter Manufacturing
Solder Paste Inspections (SPI) is a critical, quality-driven solution that ensures solder paste printers achieve high standards of printed circuit board (PCB) process compliance. The solder paste printing process is one of the most important parts of the Surface Mount Technology (SMT) assembly as it directly impacts product quality and reliability — excessive or insufficient amounts of solder paste can lead to unreliable joints, which are unacceptable in high-quality production. Thus, SPI systems were developed to meet manufacturers' need for precise monitoring of solder paste alignment and volume during the printing process.
This intricate process involves various factors that can contribute to defects, such as the precise deposition of solder particle balls on the pads. Even if the solder paste looks fine to the naked eye, it may still result in the poorly soldered PCBs, including issues like poor joint quality, solder balling and voids. According to the IPC research, approximately 70% of defects in the SMT process are caused by issues in the solder paste printing stage.
The Importance Of Solder Paste Inspection (SPI)
As solder paste and solder balls become increasingly smaller, the complexity of inspection increases, requiring advanced SPI systems equipped with high-resolution vision technology to identify defects with precision. In order to ensure the desired amount of solder paste has been deposited without defects and that the process is repeatable, it is important to have a dependable and advanced SPI solution.
The goal is to produce high-quality PCBs efficiently and with minimal waste. SPI helps manufacturers TO achieve this by ensuring the right amount of solder paste is used, resulting in defect-free PCBs. This not only reduces costs but also shortens delivery times, making SPI an indispensable tool for modern manufacturing.
To produce error-free PCBs, solder paste inspection is the right choice. It is important to solder the joint and parts accurately because they are critical for PCB functionality. By utilizing SPI, manufacturers can identify solder paste errors early to ensure a smoother, perfected process. Without solder paste inspection, undetected issues are likely to arise. Traditional methods struggle to accurately measure solder paste, but 3D angle cameras can precisely detect solder paste volume, making solder paste inspection the best solution to avoid problems and maintain quality.
To more accurately measure solder thickness, area, volume, and regularity of the solder deposition, three-dimensional (3D) technology is required. ViTrox introduces the V310i Advanced 3D Paste Inspection Solutions (SPI), designed with a customizable fine lens system that allows precise measurement of solder paste deposits on PCB pads. Catering to a wide range of industries, including server or telecommunication, automotive, consumer electronics, and medical, our SPI offers high resolution and high-speed 3D imaging technology to measure the solder paste area, volume, and height of solder paste.
SPI provided by us can effectively detect and prevent defects such as insufficient or excessive paste, missing deposits, bridging, misalignment, deformation, and micro-bridges. By identifying these defects early in the solder paste printing stage, SPI minimizes rework cost, enhances production efficiency, and ensures high-quality manufacturing process.
Revolutionizing Solder Paste Inspection with ViTrox’s V510i SPI
Our SPI, the preferred choice of top EMS Companies, features Ultra-Smart AI Programming. Powered by advanced artificial intelligence, SPI drives innovation in self-learning development while reducing reliance on manual intervention. With A.I. powered consistency and a dynamic approach to vision inspection, it eliminates the need for tedious parameter adjustments and steep learning curves. Now, programming takes just 5 minutes, enabling customers to boost productivity and optimize their operations. This highlights the fast programming speed of our SPI system.
Our SPI also excels in Advance Process Optimization by collaborating with industry-leading solder paste printers and pick-and-place equipment to identify the best printer settings for each production model. This optimization is driven by continuous data collection and performance analysis.
Additionally, our SPI is equipped with Real-Time Closed Loop System Connectivity, enabling seamless integration with our other inspection systems to improve and maintain production process efficiency, quality, and yield. For instance, the closed-loop communication ready with our AOI and AXI simplifies process troubleshooting and root-cause analysis, ensuring a more robust and reliable production process.
The Ease of Maintenance of our SPI further reduces investment cost as 95% of SPI parts are similar to V510i AOI. This compatibility allows AOI and SPI to share the same wear and tear spare parts.
Advancing into Semiconductor and Micro-electric Market
To meet evolving market demands, ViTrox has introduced the new advanced 3D SPI System, V310i Optimus. Equipped with a high-resolution 25MP camera module operating at 4.5μm/px and featuring Motorised Z-Height, the system is designed to detect even the smallest microscopic defects. Besides, the V310i Optimus adopts Augmented Phase Shift Profilometry Technology with Augmented Digital Light Processing (DLP) Projectors, resulting in highly accurate 3D reconstruction of solder paste images for precise inspection results.
Powered by advanced A.I. algorithms, including the A.I. Missing Classification feature, the 3D SPI Solution minimizes false calls rate of missing solder through. Its extended inspection capabilities – including System-in-Packages, Solder Bump, Substrate or Lead Frame, and more – provide versatility to meet diverse inspection needs across industries.
In a nutshell, it shows that SPI is unavoidable for designing and manufacturing high-quality PCBs. If you are also looking for the best quality SPI machines then ViTrox is the right option for you. At ViTrox, we offer the best reliable 3D SPI system for accurate and precise solder paste measurement. We have different models of SPI machines. Our portfolio of solder paste inspection products including the V310i Optimus 3D, V310i SPI XL, V310i SPI XXL, and V310i SE Series, designed to handle different board sizes. For those seeking innovative, durable, efficient, high speed, and high precision SPI, they should choose our SPI machines. These advanced systems are designed to provide accurate and efficient solder paste inspection for diverse production needs, ensuring exceptional quality and performance.
Why Choose ViTrox Advanced 3D Paste Inspection Solutions (SPI)?
- High Speed performance SPI system in market
- Powerful reporting for data analysis and performance monitoring
- Smart Manufacturing Ready
- Preferred choice by consumer, automotive, and telecommunication sectors
- Shareable wear & tear spare parts between 3D AOI and 3D SPI under one similar machine
- Competitive Cost of Ownership
