Overview | Revolutionary high speed 3D SPI Solution is designed to cater for the PCB manufacturing process by ensuring high quality solder paste deposition from printer. Through real-time analysis and adaptive control, our V310i 3D SPI Solution ensures solder paste deposition meets the standard and enables users to achieve impeccable PCBA quality, reduced defects, and increased yields. |
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Key Features |
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System Performances | ||
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Inspection Functions | Missing, XY Offset, Solder Height, Solder Area, Solder Volume and Bridge. | |
Board & Component Level Traceability | Camera-Read Barcodes; External Barcode Reader Configured | |
System Hardware | 12MP | 4MP |
Operating System | Windows 10 (64-bit) | |
Optical Resolution & FOV Size * | Default: 60mm x 45mm @ 15µm telecentric lens Option: 52mm x 39mm @ 13µm telecentric lens 40mm x 30mm @ 10μm telecentric lens 32mm x 24mm @ 8µm telecentric lens |
Default: 40mm x 40mm @ 20µm telecentric lens |
Inspection Speed | 12MP CoaXPress @ 15µm Resolution: Up to 94cm²/sec 12MP CameraLink @ 15µm Resolution: Up to 60cm²/sec |
4MP CameraLink @ 20µm Resolution: Up to 55cm²/sec |
3D Technologies | Phase Shift Profilometry (PSP) Methodology | |
Lighting Module | Concurrent RGB Lighting Module | |
Conveyor Width Adjustment | Auto Width Adjustment; Bottom-Up Clamping; In-line SMEMA | |
PCB Dimension | Standard | FDL |
Maximum PCB Size (L x W) | 510mm x 510mm (20" x 20") ** Option: 450mm x 510mm (17.7" x 20") *** |
DL Equal: 510mm x 235mm (20" x 9.2") ** Single Lane: 510mm x 420mm (20" x 16.5") ** Option: DL Equal: 450mm x 235mm (17.7" x 9.2") *** Single Lane: 450mm x 420mm (17.7" x 16.5") *** |
Minimum PCB Size (L x W) | 50mm x 50mm (2" x 2") | 50mm x 50mm (2" x 2") |
Maximum PCB Inspectable Area (L x W) | 510mm x 503mm (20" x 19.8") ** Option: 450mm x 503mm (17.7" x 19.8") *** |
DL Equal: 510mm x 228mm (20" x 8.9") ** Single Lane: 510mm x 413mm (20" x 16.2") ** Option: DL Equal: 450mm x 228mm (17.7" x 8.9") *** Single Lane: 450mm x 413mm (17.7" x 16.2") *** |
Maximum PCB Thickness | 4mm (0.15") | 4mm (0.15") |
Minimum PCB Thickness | 0.5mm (0.02") | 0.5mm (0.02") |
Maximum PCB Weight | 3kg | 3kg |
Top Clearance of PCB | 50mm | 50mm |
Bottom Clearance of PCB | 70mm | 70mm |
PCB Edge Clearance | 3.5mm | 3.5mm |
PCB Transport Height | 890mm - 965mm | |
PCB Temperature | Ambient operating temperature is ~5⁰C to 40⁰C, maximum PCB temperature 80⁰C. | |
Installation Specification | ||
System Footprint (Width X Depth X Height) | 1060mm x 1353mm x 2111mm | |
Total System Weight | ~900kgs | |
Power Supplies | 100-120V, 16A/200-240V, 8A Single Phase | |
Air Requirement | N/A | |
Remark | * Based on system configuration. ** with extended casing *** without extended casing Specifications are subject to change. |
Revolutionary 3D SPI system for advanced packaging that resolves challenging and miniature defects detection with automation and flexibility.
Extended size capabilities for large board sizes up to 460mm x 690mm (18.1" x 27.2")
Extended size capabilities for extra large board sizes up to 1200mm x 690mm (47.2" x 27.2")
Next generation SPI solution designed specifically to cater for PCB manufacturing and equipped with essential inspection functionalities.
Extended size capabilities for extra large board sizes up to 1200mm x 690mm (47.2" x 27.2")