V310i SE
SMT PCB Assembly | Advanced 3D Solder Paste Inspection (SPI)| Overview | The V310i SE system is the next generation SPI solution designed specifically for the PCB manufacturing process and equipped with essential inspection functionalities. It is a revolutionary 3D SPI Solution to ensures high-quality solder paste deposition from the printer. Through real-time analysis and adaptive control, our V310i 3D SPI Solution ensures solder paste deposition meets the standard and enables users to achieve impeccable PCBA quality, reduced defects, and increased yields. |
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| Key Features |
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| System Performances | ||
|---|---|---|
| Inspection Functions | Missing, XY Offset, Solder Height, Solder Area, Solder Volume and Bridge. | |
| Board & Component Level Traceability | Camera-Read Barcodes; External Barcode Reader Configured | |
| System Hardware | 12MP | 4MP |
| Operating System | Windows 10 (64-bit) | |
| Optical Resolution & FOV Size * | Default: 60mm x 45mm @ 15µm telecentric lens Option: 52mm x 39mm @ 13µm telecentric lens 40mm x 30mm @ 10μm telecentric lens 32mm x 24mm @ 8µm telecentric lens |
Default: 40mm x 40mm @ 20µm telecentric lens |
| Inspection Speed | 12MP CoaXPress @ 15µm Resolution: Up to 94cm²/sec 12MP CameraLink @ 15µm Resolution: Up to 60cm²/sec |
4MP CameraLink @ 20µm Resolution: Up to 55cm²/sec |
| 3D Technologies | Phase Shift Profilometry (PSP) Methodology | |
| Lighting Module | Concurrent RGB Lighting Module | |
| Conveyor Width Adjustment | Auto Width Adjustment; Bottom-Up Clamping; In-line SMEMA | |
| PCB Dimension | Standard | FDL |
| Maximum PCB Size (L x W) | 510mm x 540mm (20" x 21.2") Option: 610mm x 540mm (24" x 21.2") |
DL Equal: 510mm x 250mm (20" x 9.8") Single Lane: 510mm x 450mm (20" x 17.7") |
| Minimum PCB Size (L x W) | 50mm x 50mm (2" x 2") | 50mm x 50mm (2" x 2") |
| Maximum PCB Inspectable Area (L x W) | 510mm x 533mm (20" x 20.9") Option: 610mm x 533mm (24" x 20.9") |
DL Equal: 510mm x 243mm (20" x 9.5") Single Lane: 510mm x 443mm (20" x 17.4") |
| Maximum PCB Thickness | 4mm (0.16") Option: 7mm (0.28") |
4mm (0.16") |
| Minimum PCB Thickness | 0.5mm (0.02") | 0.5mm (0.02") |
| Maximum PCB Weight | 3kg (Option: 7kg) | 3kg |
| Top Clearance of PCB | 50mm | 50mm |
| Bottom Clearance of PCB | 100mm (Option: 90mm) | 100mm |
| PCB Edge Clearance | 3.5mm | 3.5mm |
| PCB Transport Height | 890mm - 965mm | |
| PCB Temperature | Ambient operating temperature is ~5⁰C to 40⁰C, maximum PCB temperature 80⁰C. | |
| Installation Specification | ||
| System footprint (Width X Depth X Height) | 1060mm x 1303mm x 2000mm | |
| Total System Weight | ~830kgs | |
| Power Supplies | 100-120V, 16A/200-240V, 8A Single Phase | |
| Air Requirement | N/A | |
| Remark | * Based on system configuration. Specifications are subject to change. |
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V310i Optimus 3D
High-accurate inline 3D SPI system designed to cater for PCB manufacturing by ensuring high-quality solder paste deposition from the printer.
V310i XL
Extended size capabilities for large board sizes up to 460mm x 690mm (18.1" x 27.2")
V310i XXL
Extended size capabilities for extra large board sizes up to 1200mm x 690mm (47.2" x 27.2")
V310i SE XXL
Extended size capabilities for extra large board sizes up to 1200mm x 690mm (47.2" x 27.2")
