V310i SPI for Advanced Packaging and Microelectronics
Backend Semiconductor | Smart 3D SPI System| Overview | Revolutionary high speed 3D SPI system for advanced packaging and microelectronics that resolve challenging and miniature defects detection with automation and flexibility. |
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| Key Features |
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| System Performances | |
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| Inspection Functions | Missing, XY Offset, Solder Height, Solder Area, Solder Volume, Bridge and Micro Bridge. Extended Capabilities: Leadframe Inspection, Solder Bump Inspection, SiP Inspection. |
| Board & Component Level Traceability | Camera-Read Barcodes; External Barcode Reader Configured |
| System Hardware | |
| Operating System | Windows 10 (64-bit) |
| Optical Resolution & FOV Size * | 25MP CoaXPress Camera @ 4.5μm telecentric lens |
| Inspection Speed | 25MP CoaXPress @ 4.5µm Resolution: 7-15cm²/sec |
| 3D Technologies | Phase Shift Profilometry’s (PSP) Methodology |
| Lighting Module | Multi-Segment LED Lighting |
| Conveyor Width Adjustment | Auto Width Adjustment; Bottom-Up Clamping; In-line SMEMA |
| Board Dimension | Standard |
| Maximum Board Size (L x W) | 470mm x 500mm (18.5" x 19.6") |
| Minimum Board Size (L x W) | 50mm x 50mm (2" x 2") |
| Maximum Board Inspectable Area (L x W) | 470mm x 493mm (18.5" x 19.4") |
| Maximum Board Thickness | 4mm (0.15") |
| Minimum Board Thickness | 0.2mm (0.00787") |
| Maximum PCB Weight | 3kg |
| Top Clearance of PCB | 10mm |
| Bottom Clearance of PCB | 70mm |
| PCB Edge Clearance | 3.5mm |
| PCB Transport Height | 890mm - 965mm |
| PCB Temperature | Ambient operating temperature is ~5⁰C to 40⁰C, maximum PCB temperature 80⁰C. |
| Installation Specification | |
| System footprint (Width X Depth X Height) | 1060mm x 1353mm x 2111mm |
| Total System Weight | ~900kgs |
| Power Supplies | 100-120V, 16A/200-240V, 8A Single Phase |
| Air Requirement | 0.6 Mpa/85 psi |
| Remark | * Based on system configuration. Specifications are subject to change. |
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