V310i XXL

SMT PCB Assembly | Advanced 3D Solder Paste Inspection (SPI)

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Overview Revolutionary high speed V310i 3D SPI Solution is designed to cater for the PCB manufacturing process by ensuring high quality solder paste deposition from the printer. The V310i XXL system is the largest SPI platform among V310i SPI Solutions with the latest vision technologies, designed to cater for extra-large board sizes up to 1200mm x 690mm (47.2" x 27.2"). Through real-time analysis and adaptive control, our V310i 3D SPI Solution ensures solder paste deposition meets the standard and enables users to achieve impeccable PCBA quality, reduced defects, and increased yields.
Key Features
  1. Effortless programming through intelligent parameter setting and machine learning feature
  2. High speed performance 3D SPI system in the market
  3. High-resolution 3D imaging technology
  4. Best reliable 3D SPI system with accurate and precise solder paste measurement
  5. Real-time closed-loop and data cross referencing among ViTrox solutions (SPI to AXI)
  6. Smart manufacturing ready with collaboration with Solder Paste Printers and Pick-and-Place equipments
  7. Preferred choice of Top EMS Companies
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Advanced 3D Solder Paste Inspection (SPI) V310i XXL

System Performances
Inspection Functions Missing, XY Offset, Solder Height, Solder Area, Solder Volume and Bridge.
Board & Component Level Traceability Camera-Read Barcodes; External Barcode Reader Configured
System Hardware 12MP 4MP
Operating System Windows 10 (64-bit)
Optical Resolution & FOV Size * Default: 60mm x 45mm @ 15µm telecentric lens

Option: 52mm x 39mm @ 13µm telecentric lens
40mm x 30mm @ 10μm telecentric lens
32mm x 24mm @ 8µm telecentric lens
Default: 40mm x 40mm @ 20µm telecentric lens
Inspection Speed 12MP CoaXPress @ 15µm Resolution: Up to 94cm²/sec
12MP CameraLink @ 15µm Resolution: Up to 60cm²/sec
4MP CameraLink @ 20µm Resolution: Up to 55cm²/sec
3D Technologies Phase Shift Profilometry (PSP) Methodology
Lighting Module Concurrent RGB Lighting Module
Conveyor Width Adjustment Auto Width Adjustment; Bottom-Up Clamping; In-line SMEMA
PCB Dimension Standard FDL
Maximum PCB Size (L x W) 620mm x 690mm (24.4" x 27.2")

Option:
960mm x 690mm (37.8" x 27.2")
1200mm x 690mm (47.2" x 27.2")
DL Equal: 620mm x 325mm (24.4" x 12.8")
Single Lane: 620mm x 600mm (24.4" x 23.6")

Option:
DL Equal: 960mm x 325mm (37.8" x 12.8")
Single Lane: 960mm x 600mm (37.8" x 23.6")
Minimum PCB Size (L x W) 50mm x 50mm (2" x 2") 50mm x 50mm (2" x 2")
Maximum PCB Inspectable Area (L x W) 620mm x 683mm (24.4" x 26.9")

Option: 960mm x 683mm (37.8" x 26.9")
1200mm x 683mm (47.2" x 26.9")
DL Equal: 620mm x 318mm (24.4" x 12.5")
Single Lane: 620mm x 593mm (24.4" x 23.3")

Option: DL Equal:960mm x 318mm (37.8" x 12.5")
Single Lane: 960mm x 593mm (37.8" x 23.3")
Maximum PCB Thickness 15mm (0.59") 15mm (0.59")
Minimum PCB Thickness 0.5mm (0.02") 0.5mm (0.02")
Maximum PCB Weight 7kg (Option: 15kg) 7kg
Top Clearance of PCB 50mm 50mm
Bottom Clearance of PCB 70mm 70mm
PCB Edge Clearance 3.5mm 3.5mm
PCB Transport Height 890mm - 965mm
PCB Temperature Ambient operating temperature is ~5⁰C to 40⁰C, maximum PCB temperature 80⁰C.
Installation Specification
System Footprint (Width X Depth X Height) 1410mm x 1500mm x 2207mm
Total System Weight ~1180kgs
Power Supplies 100-120V, 16A/200-240V, 8A Single Phase
Air Requirement 0.6 Mpa/85 psi
Remark * Based on system configuration.
Specifications are subject to change.
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