Overview | Revolutionary high speed V310i 3D SPI Solution is designed to cater for the PCB manufacturing process by ensuring high quality solder paste deposition from the printer. The V310i XXL system is the largest SPI platform among V310i SPI Solutions with the latest vision technologies, designed to cater for extra-large board sizes up to 1200mm x 690mm (47.2" x 27.2"). Through real-time analysis and adaptive control, our V310i 3D SPI Solution ensures solder paste deposition meets the standard and enables users to achieve impeccable PCBA quality, reduced defects, and increased yields. |
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Key Features |
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System Performances | ||
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Inspection Functions | Missing, XY Offset, Solder Height, Solder Area, Solder Volume and Bridge. | |
Board & Component Level Traceability | Camera-Read Barcodes; External Barcode Reader Configured | |
System Hardware | 12MP | 4MP |
Operating System | Windows 10 (64-bit) | |
Optical Resolution & FOV Size * | Default: 60mm x 45mm @ 15µm telecentric lens Option: 52mm x 39mm @ 13µm telecentric lens 40mm x 30mm @ 10μm telecentric lens 32mm x 24mm @ 8µm telecentric lens |
Default: 40mm x 40mm @ 20µm telecentric lens |
Inspection Speed | 12MP CoaXPress @ 15µm Resolution: Up to 94cm²/sec 12MP CameraLink @ 15µm Resolution: Up to 60cm²/sec |
4MP CameraLink @ 20µm Resolution: Up to 55cm²/sec |
3D Technologies | Phase Shift Profilometry (PSP) Methodology | |
Lighting Module | Concurrent RGB Lighting Module | |
Conveyor Width Adjustment | Auto Width Adjustment; Bottom-Up Clamping; In-line SMEMA | |
PCB Dimension | Standard | FDL |
Maximum PCB Size (L x W) | 620mm x 690mm (24.4" x 27.2") Option: 960mm x 690mm (37.8" x 27.2") 1200mm x 690mm (47.2" x 27.2") |
DL Equal: 620mm x 325mm (24.4" x 12.8") Single Lane: 620mm x 600mm (24.4" x 23.6") Option: DL Equal: 960mm x 325mm (37.8" x 12.8") Single Lane: 960mm x 600mm (37.8" x 23.6") |
Minimum PCB Size (L x W) | 50mm x 50mm (2" x 2") | 50mm x 50mm (2" x 2") |
Maximum PCB Inspectable Area (L x W) | 620mm x 683mm (24.4" x 26.9") Option: 960mm x 683mm (37.8" x 26.9") 1200mm x 683mm (47.2" x 26.9") |
DL Equal: 620mm x 318mm (24.4" x 12.5") Single Lane: 620mm x 593mm (24.4" x 23.3") Option: DL Equal:960mm x 318mm (37.8" x 12.5") Single Lane: 960mm x 593mm (37.8" x 23.3") |
Maximum PCB Thickness | 15mm (0.59") | 15mm (0.59") |
Minimum PCB Thickness | 0.5mm (0.02") | 0.5mm (0.02") |
Maximum PCB Weight | 7kg (Option: 15kg) | 7kg |
Top Clearance of PCB | 50mm | 50mm |
Bottom Clearance of PCB | 70mm | 70mm |
PCB Edge Clearance | 3.5mm | 3.5mm |
PCB Transport Height | 890mm - 965mm | |
PCB Temperature | Ambient operating temperature is ~5⁰C to 40⁰C, maximum PCB temperature 80⁰C. | |
Installation Specification | ||
System Footprint (Width X Depth X Height) | 1410mm x 1500mm x 2207mm | |
Total System Weight | ~1180kgs | |
Power Supplies | 100-120V, 16A/200-240V, 8A Single Phase | |
Air Requirement | 0.6 Mpa/85 psi | |
Remark | * Based on system configuration. Specifications are subject to change. |
Revolutionary 3D SPI system for advanced packaging that resolves challenging and miniature defects detection with automation and flexibility.
High-accurate inline 3D SPI system designed to cater for PCB manufacturing by ensuring high-quality solder paste deposition from the printer.
Extended size capabilities for large board sizes up to 460mm x 690mm (18.1" x 27.2")
Next generation SPI solution designed specifically to cater for PCB manufacturing and equipped with essential inspection functionalities.
Extended size capabilities for extra large board sizes up to 1200mm x 690mm (47.2" x 27.2")