V510i AOI for Advanced Packaging and Microelectronics
Backend Semiconductor | Advanced 3D Optical Inspection (AOI)| Overview | Next generation 3D AOI for advanced packaging that resolves challenging inspection with automation and flexibility. |
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| Key Features |
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| System Performances | ||
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| Inspection Functions | • Mirror/Shiny/Reflective Component Surface (Lead Frame or Substrate) • Component Offset, Die Presence, Die Offset, Die Coplanarity, Die Chip-off/Crack, Die Orientation, and other Surface Defects on Die (Scratches, Contamination, etc). • Gold Pad/Finger Surface Inspection • Foreign Material Detection • Coordinates Measurement |
• Mirror/Shiny/Reflective Component Surface (Lead Frame or Substrate) • Component Offset, Die Presence, Die Offset, Die Coplanarity, Die Chip-off/Crack, Die Orientation, and other Surface Defects on Die (Scratches, Contamination, etc). • Wire bond inspection: Missing Wire, Broken Wire, Sagging/Shifted Wire, Off Pad Bonding, Ball Bond Diameter, Shorted Wire, Wrong Bond • Gold Pad/Finger Surface Inspection • Foreign Material Detection • Coordinates Measurement |
| Board & Component Level Traceability | Camera-Read Barcodes; External Barcode Reader Configured; OCR Capability with Batch Code Logging | |
| System Hardware | 25MP | 25MP |
| Operating System | Windows 10 (64-bit) | |
| Optical Resolution & FOV Size * | 44.2mm x 44.2mm @ 9μm telecentric lens 34.4mm x 34.4mm @ 7µm telecentric lens 29.5mm x 29.5mm @ 6µm telecentric lens |
24.6mm x 24.6mm @ 5μm telecentric lens 12.3mm x 12.3mm @ 2.5μm telecentric lens |
| Inspection Speed | 25MP CoaXPress @ 9μm resolution: Up to 27.9cm²/sec 25MP CoaXPress @ 7μm resolution: Up to 16.9cm²/sec 25MP CoaXPress @ 6μm resolution: Up to 12.4cm²/sec |
25MP CoaXPress @ 5μm resolution: Up to 8.6cm²/sec 25MP CoaXPress @ 2.5μm resolution: Up to 2.2cm²/sec |
| 3D Technologies | True 3D Inspection with Phase Shift Profilometry (PSP) Methodology with 4-way projectors | |
| Lighting Module | Built-in Coaxial Lighting Module, Multiple Color, Multiple Angle, Multiple Segment LED Lighting Head, Auto Calibration Concurrent Lighting Module | |
| Conveyor Width Adjustment | Auto Width Adjustment; Bottom-Up Clamping; In-line SMEMA | |
| Board Dimension | ||
| Maximum Board Size (L x W) | 490mm x 510mm (19.2" x 20") | 470mm x 500mm (18.5" x 19.6") |
| Minimum Board Size (L x W) | 50mm x 50mm (2" x 2") | 50mm x 50mm (2" x 2") |
| Maximum PCB Inspectable Area (L x W) | 490mm x 503mm (19.3" x 19.8") | 470mm x 493mm (18.5" x 19.4") |
| Maximum PCB Thickness | 4mm (0.15") | 4mm (0.15") |
| Minimum PCB Thickness | 0.2mm (0.00787") | 0.2mm (0.00787") |
| Maximum PCB Weight | 3kg | 3kg |
| Top Clearance of PCB | 35mm | 10mm |
| Bottom Clearance of PCB | 70mm | 70mm |
| PCB Edge Clearance | 3.5mm | 3.5mm |
| PCB Transport Height | 890mm - 965mm | |
| PCB Temperature | Ambient operating temperature is ~5⁰C to 40⁰C, maximum PCB temperature 80⁰C. | |
| Installation Specification | ||
| System Footprint (Width X Depth X Height) | 1060mm x 1353mm x 2111mm | |
| Total System Weight | ~900kgs | |
| Power Supplies | 100-120V, 16A/200-240V, 8A Single Phase | |
| Air Requirement | 0.6 Mpa/85 psi | |
| Remark | * Based on system configuration. Specifications are subject to change. |
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