V510i XLW

SMT PCB Assembly | Advanced 3D Optical Inspection (AOI)

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Overview Award-winning V510i 3D AOI Solution is designed specifically for the PCB manufacturing process. The V510i XLW system supports extra large and extra wide board with extended size capabilities for largest board sizes up to 1320.8mm x 1320.8mm (52" x 52"). Equipped with high-resolution technology and AI-powered capabilities, the V510i 3D AOI Solution excels in defect detection through comprehensive inspection coverage, high accuracy and high-speed performance.
Key Features
  1. High speed and accurate inspection with Real 3D Measurement
  2. AI-Powered technology for Automated, Smart, Easy and Quality Programming
  3. AI assisted auto defect buyoff (VVTS), offering >90% of judgement accuracy for effective labor and cost saving, minimizing human judgement error
  4. Unique and universal detection coverage for unconventional application
  5. AOI centralized control tower for machine performance tracking (yield, DPPM, FPPM) and remote program fine-tuning
  6. Cost-effective and ease of maintenance with 95% shareable parts between 3D AOI and 3D SPI similar machines
  7. Preferred choice of Top EMS Companies
  8. Smart manufacturing ready
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Advanced 3D Optical Inspection (AOI) V510i XLW

System Performances
Inspection Functions Missing, Offset, Skewed, Polarity, Billboard, Tombstone, Lifted/Bent Leads, Excess/Insufficient Solder, Overturn, Bridging, Wrong Part (OCV Marking), Pin Through Hole (Solderability & Pin Detection), Package Coplanarity, Lifted Lead (Height Measurement), Foreign Material Detection, Polarity Dimple Measurement
Board & Component Level Traceability Camera-Read Barcodes; External Barcode Reader Configured; OCR Capability with Batch Code Logging
System Hardware
Operating System Windows 10 (64-bit)
Optical Resolution & FOV Size * Default: 60mm x 45mm @ 15µm telecentric lens

Option:
52mm x 39mm @ 13µm telecentric lens
40mm x 30mm @ 10μm telecentric lens

32mm x 24mm @ 8µm telecentric lens
Inspection Speed 12MP CoaXPress @ 15μm resolution: up to 64cm²/sec
3D Technologies Phase Shift Profilometry (PSP) Methodology with 4-way projectors
Lighting Module Multiple Color, Multiple Angle, Multiple Segment LED Lighting Head, Auto Calibration Concurrent Lighting Module
Conveyor Width Adjustment Auto Width Adjustment; Bottom-Up Clamping; In-line SMEMA
PCB Dimension
Maximum PCB Size (L x W) 1320.8mm x 1320.8mm (52" x 52")
Minimum PCB Size (L x W) 127mm x 127mm (5" x 5")
Maximum PCB Inspectable Area (L x W) 1310.8mm x 1310.8mm (51.6" x 51.6")
Maximum PCB Thickness 10mm (0.39")
Minimum PCB Thickness 1.5mm (0.06")
Maximum PCB Weight 15kg (Option: 25kg)
Top Clearance of PCB 50mm
Bottom Clearance of PCB 70mm
PCB Edge Clearance 5mm (Option: 10mm for 25kg)
PCB Transport Height 900mm - 965mm
PCB Temperature Ambient operating temperature is ~5⁰C to 40⁰C, maximum PCB temperature 80⁰C.
Installation Specification
System Footprint (Width X Depth X Height) 1800mm x 2174mm x 2105mm
Total System Weight ~2000kgs
Power Supplies 100-120V, 16A/200-240V, 8A Single Phase
Air Requirement 0.6 Mpa/85 psi
Remark * Based on system configuration.

Note:
1. 2D configuration option is available.
Specifications are subject to change.
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