V810Ai QX1
SMT PCB Assembly | Smart 3D AXI System| Overview | Revolutionary Smart 3D AXI System with A.I. Solutions. It is the pioneer AXI platform that delivers ultra-high resolution imaging for reliable detection of miniature defects like HiP and accurate reconstruction of internal structures in 3D advanced packaging. Equipped with Advanced Planar CT, enables dual-sided PCB inspection with selective slice analysis for comprehensive defect detection. |
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| Key Features |
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| System controller | Integrated controller with 8 Core Intel Xeon processors，Intel Xeon | |
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| Operating system | Windows 10 (64-bit) | |
| Test Development Environment | ||
| User interface | Microsoft Windows based software solution with easy-to-use GUI and password-protected user levels | |
| Off-line test development software | Optional for off-line PC | |
| CAD conversion tool | Support 4 different types of CAD in V810i software and optional software available to translate other CAD data to ViTrox's format | |
| Typical test development time | 4 hours to 1.5 days to convert raw CAD file and develop application | |
| Line Integration | ||
| Transport heights | 880mm - 950mm | |
| Line communication standard | SMEMA, HERMES | |
| Barcode readers | Compatible with most industry standard barcode readers | |
| Performance Parameters | ||
| False Call rate | 500 - 1000ppm | |
| Minimum features detection capability | ||
| Joint pitch¹ | 0.1mm and above | |
| Short width² | 0.015mm | |
| Solder thickness | 0.0127mm | |
| Allowable Panel Characteristics | Standard | |
| Maximum PCB Size (L x W) | 50°: 800mm x 600mm (31.4" x 23.6") 30°: 1015mm x 600mm (39.9" x 23.6") |
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| Minimum PCB Size (L x W) | 50mm x 50mm (2” x 2”) | |
| Maximum PCB inspectable area | Single Stage: 50°: 400mm X 594mm (15.7" x 23.3") 30°: 650mm X 594mm (25.5" x 23.3") |
Dual Stage (Long Board): 50°: 800mm X 594mm (31.4" x 23.3") 30°: 1015mm X 594mm (39.9" x 23.3") |
| Nominal Pixel Range | *2μm#, 4um, 8μm, 15μm, 22μm, 30μm | |
| Maximum PCB thickness | 15mm (590mils) | |
| Minimum PCB thickness | 0.508mm (20mils) | |
| PCB warp | Downward < 3mm; Upward < 3mm | |
| Maximum PCB weight | 15kg (25kg Optional) | |
| Top Clearance of PCB | 10mm - 90mm (Inclusive board thickness) | |
| Bottom Clearance of PCB | 130mm | |
| PCB edge clearance | 3mm | |
| 100% Press-fit testability | Yes (With PSP2 / PSP2.1 feature) | |
| PCB Temperature | 40⁰C | |
| Safety Standards | X-ray radiation leakage is below 0.5 µSv/hr | |
| Installation Specification | ||
| Power Supplies | 200 – 240 VAC three phase; 380 – 415 VAC three phase wye (+/- 5) (50Hz or 60Hz) | |
| Air requirement | 552kPA (80psi) compressed air | |
| System footprint (Width X Depth X Height) | 1878mm x 2430mm x 2425mm | |
| Total system weight | ~6000kgs | |
| Remark | *Note 1: 1. Assuming pad width is 50% of pitch. 2. The reported values for minimum feature detection assume that the feature is in a single plane of focus and that there are no X-ray absorbers in the X-ray path or in the immediate area of the feature other than those found in a typical multi-layer printed circuit board. # 1x1 Binning Mode **Note 2: 1. Panels are supported and transported along their width edges. For panels with edge cutouts, a carrier may be required to ensure proper handling and stability during the process. 2. The maximum panel size dimensions and weight must include carrier if applicable. 3. Smaller panels can be accommodated for testing with the use of panel carriers. 4. The imaging results may be affected by the layout of the surface-mounted components, depending on the thickness of the panel. 5. Bottom of the panel is the reference for the measurements including the maximum warpage. |
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