V510i Optimus 3D (for Advanced Packaging and Microelectronics) : Advanced 3D Optical Inspection System (AOI)


The new 3D AOI system for advanced packaging and microelectronics is a newly launch 3D optical vision platform that resolve challenging and miniature defects detection with automation & flexibility.
2d + 3d advanced optical inspection (aoi) v510i
System AOI for Advanced Packaging
System Performances
Component Defect Inspection Categories
  • Mirror/Shiny/Reflective Component Surface (Lead Frame or Substrate)
  • Component Offset, Die Presence, Die Offset, Die Coplanarity, Die Chip-off/Crack, Die Orientation, and other Surface Defects on Die (Scratches, Contamination, etc).
  • Gold Pad/Finger Surface Inspection
  • Foreign Material Detection
  • Coordinates Measurement
  • Mirror/Shiny/Reflective Component Surface (Lead Frame or Substrate)
  • Component Offset, Die Presence, Die Offset, Die Coplanarity, Die Chip-off/Crack, Die Orientation, and other Surface Defects on Die (Scratches, Contamination, etc).
  • Wire bond inspection: Missing Wire, Broken Wire, Sagging/Shifted Wire, Off Pad Bonding, Ball Bond Diameter, Shorted Wire, Wrong Bond
  • Gold Pad/Finger Surface Inspection
  • Foreign Material Detection
  • Coordinates Measurement
Board Level Traceability Camera-Read Barcodes; External Barcode Reader Configured; OCR Capability with Batch Code Logging
System Hardware 12MP 25MP
Operating System Windows 10 (64-bit)
Optical Resolution & FOV Size 40mmx30mm @ 10μm telecentric lens
32mmx24mm @ 8µm telecentric lens
22.5mmx22.5mm @ 4.5μm telecentric lens
Inspection Speed 12MP CoaXPress @ 10μm resolution: 28-42cm²/sec
12MP CoaXPress @ 8μm resolution: 18-26cm²/sec
25MP CoaXPress @ 4.5μm resolution: 7-15cm²/sec
3D Technologies True 3D Inspection with Phase Shift Profilometry’s (PSP) Methodology with 4-way projectors
Lighting Module Built-in Coaxial Lighting Module, Multiple Color, Multiple Angle, Multiple Segment LED Lighting Head, Auto Calibration Concurrent Lighting Module
Conveyor Width Adjustment Auto Width Adjustment; Bottom-Up Clamping; In-line SMEMA Auto Width Adjustment; Bottom-Up Clamping; In-line SMEMA
Board Dimension
Maximum Board Size (L x W) 490mmx510mm (19.2"x20") 470mmx500mm (18.5"x19.6")
Minimum Board Size (L x W) 50mmx50mm (2"x2") 50mmx50mm (2"x2")
Maximum Board Thickness 4mm (0.15") 4mm (0.15")
Minimum Board Thickness 0.2mm (0.00787") 0.2mm (0.00787")
Maximum PCB Weight 3kg 3kg
Top Clearance of PCB 35mm 10mm
Bottom clearance of PCB 70mm 70mm
PCB Edge Clearance 3.5mm 3.5mm
PCB Transport Height 875mm-965mm 875mm-965mm
PCB Temperature Ambient operating temperature is ~5⁰C to 40⁰C, maximum PCB temperature 80⁰C.
* Based on system configuration
   Specifications are subject to change.