V310i : Advanced 3D Solder Paste Inspection System (SPI)


V310i Advanced 3D Solder Paste Inspection System (SPI) soluton.
The V310i Series offers powerful technologies and high throughput productivity for SMT production line.
Solder paste inspection system (spi) V310i
Board Dimensions V310i
Maximum board size (Single Lane) -
Maximum board size 510 mm by 510 mm (20 inch by 20 inch) with 2 projectors
Minimum board size 50 mm by 50 mm (2 inch by 2 inch)
Maximum board thickness 4 mm (0.16 inch)
Minimum board thickness 0.5 mm (0.02 inch)
Board weight Up to 3kg (6.6lb)
Maximum inspected area 503 mm by 510 mm (19.8 inch by 20 inch) with 2 projectors
Clearance
Top side of board 15 mm (0.6 inch)
Bottom side of board 50 mm (1.96 inch)
Minimum edge clearance 3.5 mm (0.14 inch)
Maximum PCB Warpage ±5mm
Conveyor height range 856 mm to 965 mm (33.7 inch to 37.9 inch)
System Dimensions
Footprint W: 1060 mm (3.5 ft) x D: 1352 mm (4.4 ft) x H: 2028 mm (6.7 ft)
Weight ~750 kgs