V810i S2 XLT : Advanced 3D X-ray Inspection System (V810i S2 XLT)


Designed for various sizes of PCB assemblies to increase production efficiency and cost savings for Electronic Manufacturing Services (EMS), Original Equipment Manufacturers (OEMs), Original Design Manufacturers (ODMs), and etc.
advanced 3d x-ray inspection system (axi) v810i s2 xxl
Board Dimensions V810i S2EX V810i S2 XXL V810i S2 XLT
Maximum panel size 482mm X 610mm (19" x 24") 660mm X 965mm (26" x 38") 660mm X 965mm (26" x 38")
Minimum panel size 76mm X 76mm (3" x 3") 76mm X 76mm (3" x 3") 76mm X 76mm (3" x 3")
Maximum panel inspectable area 474mm X 610mm (18.7" x 24") 654mm X 965mm (25.75" x 38") 654mm X 965mm (25.75" x 38")
Maximum panel thickness 7 mm (276 mils) 12.7 mm (500 mils) 12.7 mm (500 mils)
Minimum panel thickness 0.5mm (20 mils) 0.5mm (20 mils) 0.5mm (20 mils)
Panel warp Downside < 3.0mm; Upside < 1.5mm (PSP) Downside < 3.3mm; Upside < 3.3mm Downside < 3.3mm; Upside < 3.3mm
Maximum panel weight 4.5kg 15kg 15kg
Minimum panel weight 0.03kg 0.03kg -
Clearance
Board top clearance 50mm @ 23um resolution
38mm @ 19um resolution
11mm @ 11um resolution
(calculated from board top surface)
25mm @ 19um resolution
15mm @ 13um resolution
(calculated from board top surface)
50mm @ 19um resolution
31mm @ 15um resolution
13mm @ 11um resolution
31mm @ 10um resolution
13mm @ 7.5um resolution
(calculated from board top surface)
Board bottom clearance 70mm 80mm 80mm
Panel edge clearance 3mm 3mm 3mm
Panel width tolerance +/- 0.7mm +/- 0.7mm +/- 0.7mm
System resolution 11um/19um/23um 19um /13um 19um /15um /11um /10um /7.5um
100% Press-fit testability Yes (With PSP2 feature) Yes (With PSP2 feature) Yes (With PSP2 feature)
Maximum acceptable panel temperatures 40 Deg C 40 Deg C 40 Deg C
System Dimensions
Footprint 1566mm (W) x 2145mm (D) x 1972mm (H) 2240mm (W) x 2460mm (D) x 1980mm (H) 2240mm (W) x 2460mm (D) x 1980mm (H)
Weight ~3500kg ~5500kg ~6000kg