V810i S2 XLT : Advanced 3D X-ray Inspection System (V810i S2 XLT)


Designed for various sizes of PCB assemblies to increase production efficiency and cost savings for Electronic Manufacturing Services (EMS), Original Equipment Manufacturers (OEMs), Original Design Manufacturers (ODMs), and etc.
advanced 3d x-ray inspection system (axi) v810i s2 xxl
Allowable Panel Characteristics ** V810i S2EX V810i S2 XXL V810i S2 XLT
Maximum panel size 482 mm x 610 mm (19"x24") 660 mm x 965 mm (26"x38") 660 mm x 965 mm (26"x38")
Minimum panel size 76 mm x 76 mm (3" x 3" ) 76 mm x 76 mm (3" x 3" ) 76 mm x 76 mm (3" x 3" )
Maximum panel inspectable area 474 mm x 610 mm (18.7"x24") 654 mm x 965 mm (25.75"x38") 654 mm x 965 mm (25.75"x38")
Maximum panel thickness 7 mm (276 mils) 12.7 mm (500 mils) 12.7 mm (500 mils)
Minimum panel thickness 0.5 mm (20 mils) 0.5 mm (20 mils) 0.5 mm (20 mils)
Panel warp Downside < 3.3 mm; Upside < 1.5 mm Downside < 3.3 mm; Upside < 3.3 mm Downside < 3.3 mm; Upside < 3.3 mm
Maximum panel weight 4.5kg 15kg 15kg
Board top clearance 50 mm @ 23 µm resolution
38 mm @ 19 µm resolution
38 mm @ 10.5 µm# resolution
11 mm @ 11 µm resolution
11 mm @ 6 µm# resolution
* Calculated from Board Top surface
25 mm @ 19 µm resolution
15 mm @ 13 µm resolution
* Calculated from Board Top surface
50 mm @ 19 µm resolution
31 mm @ 15 µm resolution
13 mm @ 11 µm resolution
31 mm @ 10 µm resolution
13 mm @ 7.5 µm resolution
* Calculated from Board Top surface
Board bottom clearance 70 mm 80 mm 80 mm
Panel edge clearance 3 mm 3 mm 3 mm
Panel width tolerance ±0.7 mm ±0.7 mm ±0.7 mm
System resolution 23 µm/19 µm#, 11 µm, 10.5µm, 6µm# 19 µm/13 µm 19 µm/15 µm /11 µm/10µm/7.5 µm
100% Press-fit testability Yes (With PSP2 feature) Yes (With PSP2 feature) Yes (With PSP2 feature)
Maximum acceptable panel temperatures 40 Deg C 40 Deg C 40 Deg C
Power and Environmental
System footprint (Width X Depth X Height) 1566 mm x 2145 mm x 1972 mm 2240 mm x 2460 mm x 1980 mm 2240 mm x 2460 mm x 1980 mm
Weight ~3500 kg ~5500 kg ~6000 kg
*Note:
1. Assuming pad width is 50% of pitch.
2. The reported values for minimum feature detection assume that the feature is in a single plane of focus and that there are no X-ray absorbers in the X-ray path or in the immediate area of the feature other than those found in a typical multi-layer printed circuit board.

#2x2 binning camera configuration. Hardware upgrade is required on old system.

**Note:
1. Panels are handled on width edges. Panels with edge cut outs may require the use of a carrier.
2. Maximum panel size dimensions and weight must include carrier if applicable.
3. Smaller panels are possible with the use of panel carriers.
4. With panels of this thickness, imaging results can be affected by PCBA layout.
5. Measured from the bottom of the panel including a maximum warp.