Normal visible light wavelength ranges from 380 ~ 780 nanometers (nm), where humans can respond to or see. SWIR light is invisible or nonvisible with a wavelength of 1000 ~ 1700 nm. Wavelengths longer than visible wavelengths can only be seen by special sensors. Images generated by the SWIR camera allows you to see through what human eyes cannot.
ViTrox SWIR solutions are designed with the Military-grade camera to provide high definition vision inspection results. It is capable of inspecting inner defects such as inner crack, component missing, delamination, chip-off & etc. within the package devices especially WLCSP which is unachievable by using standard solutions.
The semiconductor industry has grown to become one of the world’s largest industries which covers a wide variety of applications, ranging from processor and memory integrated circuits for electronics to solar cells.
Today, we would like to introduce SWIR solution that will solve your trouble during the wafer manufacturing process. Defects such as crack or chipping can easily be found inside or between wafers, so the quality of the camera to inspect the imperfections is very important. Instead of using standard cameras that are capable of inspecting only the defects on the top of a wafer, SWIR cameras can do more! Images produced by SWIR solution allow you to see through the silicons and be able to detect crack, voids or other defects.
SWIR cameras can be a great solution for the die inspection process too! SWIR solution allows you to detect those defects caused by wafer dicing (before packaging), such as cracks which hide inside the silicon material.
ViTrox SWIR solution mainly is to inspect the inner defect of the device which standard vision is unable to capture with the standard hardware (lighting & camera). Below is the result image comparison of standard vision and SWIR.