| Model Type | PX40Ai | ||
| UPH△ | T&R with Inspection 40k (based on 1mm x 1mm) | ||
| Package Type | WLCSP, WLP, QFN , SiC, GaN | ||
| Die Size Range | 0.4mm x 0.4mm - 7mm x 7mm 7mm x 7mm - 15mm x 15mm |
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| Die Thickness | 0.1mm - 1mm | ||
| Process | Flip | ||
| Input | Wafer | ||
| Output | Tape & Reel, Waffle Tray* | ||
| Dimensions (L x W x H) | 2000mm x 1600mm x 2000mm | ||
| Weight | <2100kg | ||
Specifications are subject to change | *Subject to Customisation for Customised Output | △Subjected to Die Size
