| Model Type | PX730Ai | ||
| UPH△ | T&R with Inspection 25k (based on 1mm x 1mm) | ||
| Package Type | WLCSP, WLP, QFN , SiC, GaN | ||
| Die Size Range | 0.8mm x 0.8mm - 7mm x 7mm 7mm x 7mm - 15mm x 15mm |
||
| Die Thickness | 0.1mm - 1mm | ||
| Process | Flip or Non- Flip | ||
| Input | Wafer / Tape & Reel* | ||
| Output | Wafer, Tape & Reel, Waffle Tray* | ||
| Dimensions (L x W x H) | 2450mm x 1920mm x 2000mm | ||
| Weight | <2500kg | ||
Specifications are subject to change | *Subject to Customisation for Customised Output | △Subjected to Die Size
