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PX730i : Die Sorting & Vision Inspection Handler


PX730i Designed for Die Sorting, Full 6 Sided Inspection and Tape & Reel Packaging, High Speed Waffle to Die sorting Tape and Reel Dual taping Inspection and Support Waffle Die Sorting Tray Output in One Machine.
PX730i: Die Sorting & Vision Inspection Handler
Model Type PX730i
Wafer Input Type and Size
Film Frame Carrier - 6” to 12”

Round & Rectangular / Plastic & Metal Frame - 6” (150mm) , 8” (200mm) , 12” (300mm)

Wafer Cassette - 25“ x 8”, 13“ x 12”
UPH Sprint : 30K ; With Inspection : up to 24K
Sorting Index Time Down to 60ms
Device Size Range WLCSP & QFN: 0.8mm x 0.8mm; | Thickness ≥ 0.1mm
Process Flip Process, Non-flip Process
Input Wafer, Reel
Output Waffle Tray, Tape & Reel, Tape Width: 8mm, 12mm, 16mm
MTBA Typ. > 1 hr
MTBF Typ. > 168 hrs
Conversion Time Typ. < 45 mins
Input Voltage 415 VAC, 3 Phase, 50/60Hz
Compress Air 5 - 10 ±0.5 bar
Vacuum -0.5 ±0.1 bar
Dimension (LxWxH) 2450mm x 1920mm x 2000mm
Weight < 2500 kg