Emerging Machine Vision Technologies
Our latest innovation in Smart 3D X-Ray Inspection System (AXI) exceeds the conventional inspection capabilities with its advanced features. The V810AI 3D AXI Solution is equipped with high-speed AXI performance, world-class board inspection capabilities and Industry 4.0-compliant software to ensure the quality of inspection results. Designed for PCB assemblies of all sizes, it enhances production efficiency and cost-effectiveness for Electronic Manufacturing Services (EMS), Original Equipment Manufacturers (OEMs) and Original Design Manufacturers (ODMs).
With 2μm resolution, ±50° tomography, AI-based defect classification, and optional dual-lane configuration, QX1 is optimized for high-throughput inspection of complex boards.
Smart 3D X-Ray Inspection System (AXI) with industry-leading speed (~50% faster cycle time) and AI- powered defect detection, configurable for dual lane, for high- volume PCB production of standard- sized boards.
Designed for various sizes of PCB assemblies to increase production efficiency and cost savings for electronic manufacturing services, communication industry, etc.
Superior Imaging Capabilities for all joint defects
High-resolution micro BGA HiP inspection
Penetrates complex heavy shielding to ensure accurate inspection of highly dense Press Fit Pin Array ExaMAX, Paladin, Paladin HD, Impel etc
Solder joint inspection at different layers with multi slices setup
Reconstructing internal structures within 3D advanced packages
Intelligent Defects Detection for unique component characteristics and complicated backgrounds with multiple shadings
Fully automated dual-lane systems up to 50% cycle time improvement for throughput optimization
ViTrox delivers New Gen Line Scan and Flat Panel Detector systems to meet evolving industry needs with a comprehensive and ready-to-deploy solution.
Intelligent Programming for Seamless Inspection
Minimizes Operator dependency and escapees
Our Smart 3D SPI solutions cover the full spectrum of electronics and semiconductor manufacturing, from high-speed SMT assembly to AI-powered, ultra-precision back-end inspection. As a key component of the integrated ViTrox AI-native ecosystem (SPI, AOI, AXI, ARV, and V-ONE), our 3D SPI leverages intelligent closed-loop solutions to maximize yield, accelerate throughput, and ensure uncompromising quality at a highly competitive cost of ownership.
Our Intelligent 3D Optical Inspection solutions deliver high-speed, high-precision capabilities for SMT and Semiconductor industries. Featuring a market-first AI-integrated suite with Autonomous Program Creation, Intelligent Quality Control, Auto Fine-Tuning, and Auto Review, it enables a self-healing production environment dedicated to AI-powered accuracy and zero-defect manufacturing.
Built for speed and simplicity, ViTrox's Smart 3D AXI delivers the market's fastest inline inspection with an intuitive, user-friendly interface, powered by proprietary AI across inspection, programming, quality control, and auto buy-off. The QX1 model pushes precision further with 2µm resolution, while the Line Scan series adds industry-first Dual Lane architecture for maximum throughput.
ViTrox's most distinct innovation, ARV, features a 6-axis robotic arm for human-mimicking multi-angle inspection up to 90 degree for conformal coating and final assembly. The 2-in-1 capability offers extreme flexibility and CAD-less setup, it provides direct labor replacement. Unlike traditional SPI or AOI, this solution sets a new benchmark for automated visual processes in manufacturing.
V-ONE provides detailed production insights and image traceability across ViTrox's SMT inspection systems, enabling a strategic and data-driven approach to manufacturing—making it a powerful enabler for Smart Manufacturing operations.
SMTo Engineering have forged a strong and strategic partnership built on trust, innovation, and shared commitment to serving Mexico’s electronics manufacturing industry. ....
The early detection of process problems has allowed us to continuously improve our product quality ....
Adopting the V810i AXI enables our manufacturing processes to run more efficiently and with higher productivity due to the impressive AI technologies ....
ViTrox service and support has been truly outstanding. It was a pleasure to work with the team where we received many great services and supports such as quality service provided ....
一直提供及时的技术评估和售后支持,从未怠慢和影响生产,让我们的产线能平稳健康的运行 ....
Thank you for the big support on our customer Air gap inspection project. We (including our customer) are recognizing ViTrox effort on this project contributes ....
V-ONE is well equipped with great data analytics tool and can be used for every small and medium-sized enterprise (SME) ....
The Vitrox V810 was a clear choice to be a part of our SMT line. We’re creating products on the cutting-edge of technology. ....
The team has shown true dedication and determination. Without your support, the organization could not have gone that extra mile, especially at this critical moment. ....
watch the testimonial video
Since 2015, ViTrox Corporation and SMTo Engineering have forged a strong and strategic partnership built on trust, innovation, and shared commitment to serving Mexico’s electronics manufacturing industry. What began as a collaboration to address local representation needs has evolved into a long-term alliance that continues to redefine quality, reliability, and service excellence in the region.
At the time of the partnership’s inception, Mexico’s electronics sector was growing rapidly, yet access to advanced inspection technologies and dependable technical support remained limited. Recognising this opportunity, ViTrox appointed SMTo Engineering as its official representative in Mexico. With deep technical expertise and a customer-centric approach, SMTo quickly became a trusted local partner capable of delivering ViTrox’s full-line solutions, including Smart 3D Solder Paste Inspection System (SPI), Smart 3D Advanced Optical Inspection System (AOI), Smart 3D Advanced X-ray Inspection System (AXI), Smart Robotic Optical System (ARV), and VisionXpert Smart Code Reader (XS Series) and Smart Camera (XC Series), to manufacturers nationwide.
“Our partnership with ViTrox has been remarkable from the very beginning,” shared David Delgado, Operations Director of SMTo. “Their team has always been responsive and collaborative, providing consistent technical and operational support that enables us to serve our customers better. Even during the most challenging times, such as the pandemic, ViTrox worked hand in hand with us to overcome obstacles and achieve positive results together.”
Throughout the years, the partnership has achieved numerous milestones that reflect its strength and synergy. SMTo’s local investments in demo systems, customer training, and service infrastructure — supported by ViTrox’s continuous R&D innovation and global technical backing — have established a powerful value chain that benefits customers across Mexico. Together, they have installed more than 700 ViTrox systems nationwide, including V510i AOI, V310i SPI, V810i AXI, and V9i ARV solutions, helping manufacturers achieve world-class inspection quality and operational efficiency.
“ViTrox stands out not only as a technology leader but also as our best strategic partner — one that shares our values and supports our vision,” said Alejandro Olivar, Managing Director of SMTo Engineering. “Their professionalism, transparency, and continuous innovation have empowered SMTo to grow into one of Mexico’s leading providers of advanced inspection and automation solutions.”
The collaboration between ViTrox and SMTo is defined by mutual growth and customer success. By combining ViTrox’s state-of-the-art technologies and SMTo’s strong local presence and technical responsiveness, the partnership delivers tailored solutions that address real production challenges. Customers benefit from faster local support, improved inspection performance, and higher confidence in their manufacturing operations.
Beyond business achievements, both teams share a culture of trust, integrity, and teamwork. ViTrox and SMTo share the same values, which unite both companies through common roots — I.A.C.T.G., representing Integrity, Accountability, Courage, Trust and Respect, and Gratitude and Care. ViTrox’s commitment to knowledge sharing through joint training, factory visits, and engineering collaboration has elevated SMTo’s capabilities and contributed to workforce development within Mexico’s electronics ecosystem.
We are honored to receive CommScope's satisfaction testimonial who was amazed by the capabilities of the V810i Advanced 3D X-ray Inspection (AXI) Solution and the outstanding support from ViTrox's Sales Channel Partner (SCP) in Mexico, SMTo Engineering SA de CV.
CommScope is a well-known global provider of communication network infrastructure solutions — providing copper, fiber optic, and wireless network infrastructure components, network management software, network analytics, and consulting services, among other goods and services. CommScope serves a wide spectrum of customers from many industries, assisting them in the design, management, and optimization of their communication networks to meet the dynamic demands of today's digital landscape. After their successful installation of ViTrox’s V810i S2 XLT AXI in 2020, CommScope has experienced and achieved effective and efficient production processes since then.
Jonathan Ramirez, Maintenance Manager at CommScope Tijuana said, "I am pleased to recognize the exceptional work of ViTrox and SMTo Engineering, with which we have built a fruitful client-vendor relationship. We have significantly improved our production processes by installing ViTrox's V810i S2 XLT X-ray inspection machine in line. The early detection of process problems has allowed us to continuously improve our product quality, all for the benefit of our customers. Thanks to the state-of-the-art technology used by ViTrox, we can provide the best possible products and services for our clients. The V810i S2 XLT solution has proven to be a valuable asset in guaranteeing the quality of our products." Jonathan added, "SMTo Engineering, representing ViTrox, has always provided excellent support with excellent response times, which has allowed us to avoid any negative impact on our production lines. We appreciate their commitment to ensuring our production runs smoothly. We hope to continue improving our customer-supplier relationship with ViTrox and SMTo Engineering."
Telecommunication and Network market segments often involve big PCB boards and dense connectors, which require a large X-Ray inspection platform in production. ViTrox V810i S2 XLT is designed for extensive coverage of board sizes as large as 965.2mmx660.4mm (38"x26"), with a top clearance of up to 50mm. V810i S2 XLT allows users to perform programming set-up with ease and it has 7 main algorithms covering 23 preset joint types with all the threshold setting compliance with IPC Class. This AXI solution also has a powerful automated system mechanism, with a motorized Z-height for multiple resolutions of inspections that cater to different component sizes, and a motorized height sensor for extra safety precautions when it comes to component height checking. ViTrox's AXI also contains 3DCT Technology with Advanced Reconstruction Technology (ART), which offers numerous benefits, ensuring that defects are more visible and easier to detect. ART can also identify BGA balls with HiP defects which are often difficult to detect using traditional inspection methods. Therefore, users can rest assured that they will be using state-of-the-art technology for their PCBA X-Ray inspection.
Picture (Start from left) Amado De La Torre (Maintenance Supervisor), Maribel Martinez (programmer), Salvador Altamirano (SMTo Baja California Sales Manager).
Additionally, customers can be guaranteed top-notch sales and service support from ViTrox and SMTo. SMTo is a key valued partner of ViTrox in Mexico, best known for its outstanding service support in handling customer inquiries and ensuring customer satisfaction. Besides that, SMTo Engineering has established full sales and service support in Tijuana, Monterrey, Reynosa, and Chihuahua to provide better support to the customer. For more information on SMTo, please contact Juan Carlos Santoyo (juancarlos.santoyo@smto.mx) for further assistance.
ViTrox Technologies Sdn Bhd is pleased to announce that Unigen Corporation has successfully installed the V810i Advanced 3D X-Ray Inspection (AXI) Solution at its facility in the United States.
ViTrox has always actively contributed numerous technological innovations to the electronic assembly industry. Coupled with ViTrox’s latest artificial intelligence (A.I.) technology, our V810i AXI Solutions can be used for programming, classification, buy-off, and many other manufacturing inspection purposes. For example, ViTrox has integrated AI in V810i AXI systems, such as the AXI AI Smart Programming with Intelligent tuning functions and AXI AI Auto Buy Off in Repair Station. Soon, ViTrox will be launching more AI functions for AXI as well.
Apart from the AI features, V810i AXI has extensive inspection capabilities to cater to the stringent demand in the market, such as AXI Back drill inspection, voiding detection for components with multilayer solder and 5G connector inspection capabilities. In addition, AI Auto Buy Off at repair station, AI Classification and speedy programming time are a few of the V810i AXI unique selling points. Beyond that, the V810i AXI system offers easy-to-use AXI programming, which saves up 50% of the programming time for heavily shaded component inspection. Ultimately, ViTrox PCB SMT Inspection Solutions enables users to optimize production throughput with great ability to improve production efficiency while enjoying speedy and accurate SMT inspection capabilities.
"We are proud to count ViTrox among our key suppliers in our state-of-the-art factory. Adopting the V810i AXI enables our manufacturing processes to run more efficiently and with higher productivity due to the impressive AI technologies and functionality that ViTrox has developed," said Paul Heng, the CEO and President of Unigen.
Quoted from Wee Kah Khim, ViTrox Executive Vice President & Automated Board Inspection (ABI) Business Unit Head: “It is our most incredible privilege to have the opportunity to support Unigen’s manufacturing and business operation with our vision inspection solutions.”
Product quality and manufacturing yield are more critical than ever. It is also essential to achieve and sustain high-quality products and services on time for worldwide customers. Therefore, ViTrox always upholds its business practices with the company core value - I.A.C.T.G. (the acronym for 'Integrity,' 'Accountability,' 'Courage,' 'Trust and Respect,' and 'Gratitude and Care'). With two decades of experience in supporting the electronics assembly industry, ViTrox aims to be the world’s most trusted technology company as the pioneer and market leader in machine vision technology to provide the most innovative, advanced, and cost-effective machine vision solutions of excellent quality to its customers.
My experience with ViTrox service and support has been truly outstanding. It was a pleasure to work with the team where we received many great services and supports such as quality service provided, prompt support to minimize machine downtime, good quality improvement, great solutions provided on AXI camera card issue and AOI coverage improvement.
I am looking forward to work with your team on the V9i improvement. Thank you!
富士康科技集团是专业从事计算机、通讯、消费性电子等3C产品研发制造,广泛涉足数位内容、汽车零组件、通路、云运算服务及新能源、新材料开发应用的高新科技企业。
自2020年新冠疫情在世界各地蔓延以来,伟特(ViTrox)及其合作伙伴苏州建直光电科技有限公司(Linkways)一直提供及时的技术评估和售后支持,从未怠慢和影响生产,让我们的产线能平稳健康的运行。纵然疫情凶险,ViTrox及Linkways团队也愿意积极配合进厂,并出于对社会和企业负责任的态度,先进行14天的自我隔离,当专业的评估或售后支持完成后,他们又回到自己公司所在地进行14天的自我隔离。在此对贵司优秀的设备能力和技术表示很满意,对积极完善的售后服务表示很感谢!
天津富士康愿和ViTrox持续展开未来更多的合作,保持良好的沟通,使彼此间合作更顺利、效率更高并实现共同的更好的发展!
Thank you for the big support on our customer Air gap inspection project. We (including our customer) are recognizing ViTrox effort on this project contributes, it taken a long time for the study, verification, around 4 months for you guys travel support from Suzhou to Jabil Wuxi. The willingness from ViTrox to invest the RD effort for this project also highly appreciated.
We are very impressed with you and your entire team attitude and professional support. Thanks again!!!
ViTrox’s Industry 4.0 Smart Solution, V-ONE designed with many innovative features which play an essential role in supporting the real-time production process monitoring at Penang Automation Cluster Sdn. Bhd. (PAC) during the journey of digital transformation with the commitment to uplift the local precision metal fabrication ecosystem and drive the creation of a supply chain ecosystem to support Local Large Companies (LLCs) and Multinational Corporations (MNCs).
Since early 2020, ViTrox has been collaborating with PAC to implement V-ONE to strengthen PAC’s production process. With the machine connectivity and visualization through V-ONE, it enables PAC to connect the SME's legacy machines within PAC premises. Besides, V-ONE provides value-added data analytics and artificial intelligence proactive actions to strengthen the PAC real-time production process monitoring.
Recently, ViTrox is honoured to have three guests from PAC sharing their unique V-ONE experience with us. The three honoured guests are Mr Hng Chuan Keat, Operation Manager, Mr Terrence Tan, Production and Marketing Manager, and Mr Liong Hock Chuan, Machining and Tooling Manager.
“I would say V-ONE is well equipped with great data analytics tool and can be used for every small and medium-sized enterprise (SME). The most convenient feature that I like is our legacy machine’s data source can be easily retrieved from the tower light sensor kit, and digitally auto-converted and transferred to the V-ONE cloud database. V-ONE could form new strategies to enhance our manufacturing performance through detailed data analysis,” quoted by Mr Terrence Tan, Production and Marketing Manager of PAC.
“With real-time updates and customizable integration, V-ONE provides further visibility and insight across the entire production line. We can easily monitor the performance side by side with the machine or monitor from the control room remotely. Although this is just a start-up journey, we believe V-ONE could guide our production, save up to 30% of operating cost and reduce the process time cycle," said Mr Liong Hock Chuan, Machining and Tooling Manager of PAC.
"I am glad that with V-ONE's Alert Plan Development for predictive and preventive maintenance, our production engineers and technicians easily visualize the machine's threshold limit - Machine Utilization (MU) in percentage, while the auto alert receiver will be triggered if there is abnormal activity going on with the machines. Soon, we hope to connect all of our newest machines and cover the entire PAC principle activities, linking from CNC machine to Precision Tooling, Sheet Metal Fabrication, Metal Finishing, Module Assembly, and OQA, enabling IoT connectivity between each machine and be ready for Industry 4.0."
We highly encourage all to take a moment to watch a PAC testimonial video to get more insights from the three PAC managers through this link.
To discover more about Industry 4.0 Smart Solutions V-ONE and how to step closer to Industry 4.0 success? We highly recommend you to contact our sales expert by sending your enquiries to cc-vone@vitrox.com.
For more information about V-ONE, feel free to visit V-ONE official website at https://www.v-one.my/.
CHATSWORTH, CA –September 29, 2021 – NEOTech, a leading provider of electronic manufacturing services and supply chain solutions for brand name OEMs in the industrial, medical and mil/aero markets, is proud to announce the purchase of two award-winning ViTrox V810 S2 advanced 3D X-Ray Inspection (AXI) machines for it’s Longmont, CO facility.
ViTrox’s latest innovation in Advanced 3D X-Ray Inspection (AXI) is designed to specially cater to different sizes of PCB assembly to be examined at micron level with maximum throughput. This translates to increased production efficiency and cost savings.
“At our NEOTech Longmont manufacturing facility, we build and assembly vital electronic products for some of our nation’s premier military product suppliers,” commented Jon Good, NEOTech Longmont General Manager. “It is crucial we provide the highest quality and highest reliable products possible to ensure our military can successfully and safely complete their missions. The ViTrox V810 was a clear choice to be a part of our SMT line. We’re creating products on the cutting-edge of technology. The ViTrox V810 provides us the much needed latest innovations in advanced 3D X-ray inspection as product complexity continues to grow. With the addition of these two units, NEOTech not only improves the in-house X-ray inspection capability and enhances production efficiency; but, also makes sure our top priority of product quality and reliability is achieved.”
The ViTrox V810 S2 is the receipient of 9 industry awards, including the Circuits Assembly NPI, EM Asia Innovation Award, 4 Global Technology Awards, and a Best in Test award. The system is touted as the world’s fastest AXI for all types of PCBA.
NEOTech’s goal is to successfully convert customers’ product technology into engineered products, providing the most capable supply base, manufacturing products with care and delivering them on time. The company is large enough to offer refined Tier 1 tools, processes and capabilities, yet small enough to provide individualized care and service. NEOTech provides tailored project-by-project services that focus on each customer’s individual, unique needs. The result is a true collaboration in which the customer’s needs are met – or exceeded – in a timely, efficient and cost-effective manner.
With over 40 years of heritage in electronics manufacturing, NEOTech specializes in high-reliability programs in the Aerospace and Defense industry, Medical Products, and High-Tech Industrial markets. NEOTech is well recognized as a premier EMS provider with in-depth experience manufacturing high-tech products and managing stringent U.S. government requirements. For more information about NEOTech and/or the products and services, visit the company’s website at www.NEOTech.com.
"Dear V-ONE team and EA MAX team,
The team has shown true dedication and determination. Without your support, the organization could not have gone that extra mile, especially at this critical moment. Not only need to be cautious of the pandemic but also have to utilize the limited time wisely, where there still are restrictions on movement control (MCO, CMCO, RMCO..). The enthusiasm with which the team handled the project was truly exceptional. We are truly grateful and would like to express our sincere gratitude.
The company is truly graced with employees like all of you. A massive thank you to each and every one of you! Thank you so much for providing the much-needed assistance that we needed during that hectic period.
UWC is a local manufacturer for sheet metal fabrication as well as precision machining jobs for high mix low volume customers. Our back-end process manages to achieve the first department that manages to transform into a fully digital control line for the company. No doubt about the amount of effort that the team put into the job to complete it was tremendous. This also definitely has set up higher standards in the organization and also inspire other departments to continue to strive hard to move towards a digital visual manage factory.
The above achievement is a good start for UWC, V-ONE team and EA MAX team. We strongly believe with the rapid growth and expansion, there will be more opportunities for UWC—V-ONE to collaborate further. After witnessing the achievement, we are very much looking forward to working closely with the V-ONE team to completely transform into a fully digital control line (from front to back end) in the very near future.
Last but not least, on behalf of the management, once again we would like to extend our special thanks to leaders from the V-ONE team for all the amazing work done. Being a manager of an organization is difficult, but with a team like you at the back, everything seems effortless. The team has always been motivating me and pushed me to the limits so that the organization can see better days."
X-ray inspection technology, commonly referred to as Automated X-ray Inspection (AXI), uses X-ray radiation to examine the internal structure of objects or products. In modern Surface Mount Technology (SMT) production lines, AXI machines are mainly used for automated inspection of hidden solder joints that are not visible to an AOI system. This non-destructive inspection enables the identification of concealed defects or anomalies that are imperceptible to the naked eye. The increasing adoption of inline AXI systems ensures continuous validation of PCB functionality during production, thereby reducing errors in real-time with automated precision.
The AXI inspection machine is primarily divided into two types of system: 2D and 3D automated X-ray inspection system. While 2D AXI systems are cost-effective and ideal for basic assembly inspection, they often struggle to detect hidden defects within multilayered assemblies. In contrast, Smart 3D X-Ray Inspection System (AXI) have emerged as a more advanced solution. The Smart 3D X-Ray Inspection System (AXI) created detailed, three-dimensional representations that allow for the detection of hidden defects such as voids, solder joint integrity issues, and misplacements of components within multilayered circuits.
3D X-Ray inline systems are becoming more popular, 2D AXI systems remain relevant, especially in situations where cost and simplicity are more important. Both 2D and 3D AXI inspection technologies will coexist, with manufacturers choosing the one that best fits their production needs and budget. Smart 3D X-Ray Inspection System (AXI), in particular, will continue to drive innovation and expand the capabilities of SMT AXI inspection equipment across different industries, improving automated, accurate, and efficient inspections.
To address the growing demands of the electronics assembly and SMT industries, ViTrox has developed the world’s fastest 3D inline X-ray inspection machine. Our Smart 3D X-Ray Inspection System (AXI) represents a significant leap in inspection technology, designed to examine double-sided panels with exceptional defect coverage, high-speed performance, and a minimal false call rate.
Our latest innovation in Smart 3D X-Ray Inspection System (AXI) machine is capable of handling the largest and heaviest board size in the market. By adopting our Smart 3D X-Ray Inspection System (AXI), manufacturers can inspect a maximum 25kg and up to 1.3m x 1.3m (length x width) board size, making it suitable for a wide range of production requirements.
Our Smart 3D automated X-ray inspection machines can detect a wide range of detects, including missing components, shorts, opens, non-wetting, billboards, tombstones, lifted leads, solder balls, voids, insufficient solder, reversed tantalum capacitors, and excess solder. Equipped with the latest Smart 3D X-Ray Inspection System (AXI) technology and advanced inspection capabilities, this machine ensures the inline inspection of hidden joints on PCBs within the required cycle time. The powerful test algorithm provides automated, full boards, 100% test coverage for PCB assemblies, inspecting a wide range of components such as integrated power electronic component (eg, IGBT), head-in pillow, package-on -package (PoP), plated through-hole (PTH), and various connector joint issues, offering a standard unmatched by other AXI machines.
The AXI machine also offers fully automated process optimization through AI integration, enhancing inspection efficiency and accuracy, particularly for challenging pads. The Smart 3D X-Ray Inspection System (AXI) technology and AI features enable effortless automated programming, reducing setup time. With AI Classification, the machine improves accuracy for inspections of pads with multiple grayscale or unique profiles. Furthermore, the machine includes the AI VVTS, an automated defect buy-off feature that distinguishes between true and false defects with up to 95% accuracy. The integration of 3D x-ray, automated features, and inline inspection ensures optimal efficiency and reliability throughout the production process.
Our AXI machine is equipped with cutting-edge Smart 3D X-Ray Inspection System (AXI) imaging and reconstruction methods that generate high-definition, high-quality Smart 3D X-ray images for accurate defect detection. The machine includes H-reconstruction, a unique imaging and reconstruction method for heavily shaded components, ensuring clarity even in complex inspection tasks like High-Speed 5G Connector Inspection and shaded BGA packages. Additionally, the machine employs the in-house-developed Algebraic Reconstruction Technique (ART), utilizing sharp geometric 3D X-ray computed tomography (CT) to create high-quality 3D models of BGA joint types, enhancing the automated inspection process and ensuring precise detection. Our AXI machine is designed to streamline automated inspection and deliver high-speed, highly accurate results across a wide range of applications.
Our inline AXI systems also features Dual Lane (DL) capabilities, a pioneering feature that significantly enhances the automated inspection throughput by up to 45% to 50% compared to traditional single-lane AXI systems. This advanced system enables automated and inline inspection of two boards simultaneously, using a stage-moving feature that expedites the inspection process by loading and scanning two boards concurrently. The system eliminates the need for dual scan paths, ensuring a faster, more efficient automated inspection process without compromising the quality of 3D X-ray images. These 3D X-ray images provide precise and dependable inspection results, ensuring accuracy across all boards.
Continued developments in semiconductor process capabilities have reduced chip node size and 3D X-ray dosage requirements, particularly for NAND and flash memory chips. This presented a huge problem for the AXI inspection system, as building systems with minimum 3D X-ray exposure while maintaining image quality for reliable categorization became increasingly difficult. In 2023, we successfully developed a low-dose imaging solution by incorporating new 3D X-ray scintillation material into our patented Gen 3.3 camera and adding aluminum-zinc filtration. This machine allows us to meet severe radiation dosage criteria of 30mGy, balancing reduced 3D X-ray exposure with the need for high-quality images required for accurate and stable component categorization during automated inline inspections. The solution's efficacy has been proved at a few selected client sites, with radiation exposures of 15mGy or fewer,ensuring exceptional performance in inline inspection systems for modern semiconductor production.
To enhance the user experience of our customers, our AXI Solutions are featured with the new boasts high imaging resolution Up to 2µm, Configurable to 30µm, ensuring capture every critical feature. The high-speed imaging capabilities, allowing it to process a full field of view (FOV) in 1.85s. This commitment to both high imaging resolution and high-speed imaging, even during faster inspections, and it comes with Resolution Up to 2µm, Configurable to 30µm. Furthermore, its wide tomography angle of up to 50° enhances its ability to capture comprehensive data. This advanced imaging, featuring Resolution Up to 2µm, Configurable to 30µm, is powered by an AI-Powered solution autonomous programming, AI inspection, and auto buyoff, streamlining workflow. Plus, it's ready for smart manufacturing, with support for IPC-CFX-2591, IPC Hermes-9852, and SECS GEM standards.
With these latest advanced features, ViTrox remains committed to innovation by providing world-class automated Smart 3D X-Ray Inspection System (AXI) that support industries to achieve excellence through superior automated inspection technologies.
Global manufacturers like PARPRO Technologies and AsteelFlash trust ViTrox’s Smart 3D X-Ray Inspection System (AXI) to meet the demands of increasingly complex products. For instance, In early 2020, PARPRO Technologies purchased their first ViTrox 3D inline Smart X-ray Inspection System (AXI), the V810Ai S2EX system. PARPRO Technologies stated that our Smart 3D X-Ray Inspection System (AXI) is a clear choice to be part of their SMT line. The Smart 3D X-Ray Inspection System (AXI) provides them the much needed latest innovations in Smart 3D X-Ray Inspection System (AXI) as product complexity continues to grow. With the addition of these two units, Smart 3D X-Ray Inspection System (AXI) not only improves their in-house X-ray inspection capability and enhances production efficiency; but, also make sure their top priority of product quality and reliability is achieved. Another customer, who is one of the top EMS companies, AsteelFlash even shared that by applying our Smart 3D X-Ray Inspection System (AXI) to be in the manufacturing line because of its high test coverage for structural defects occurring at the solder. AsteelFlash believes that our Smart 3D X-Ray Inspection System (AXI) delivers the quality it needs.
Hence, it showed that we remain at the forefront of innovation, delivering automated Smart 3D X-Ray Inspection System (AXI) that enable industries to achieve excellence through reliable, precise, and efficient inspection mchines.
Why Choose ViTrox Smart 3D X-Ray Inspection System (AXI)?
The Problem: Quad Flat No-lead (QFN) thermal pads and Ball Grid Array (BGA) joints are entirely hidden underneath the component body. Optical systems (SPI/AOI) cannot see through the silicon package, leaving manufacturers blind to internal voids, bridging, or open circuits.
The Science: 3D Automated X-ray Inspection (AXI) transmits high-energy X-ray photons directly through the PCB assembly. Because solder (lead or tin) has a much higher atomic density than silicon, copper, or fibreglass, it absorbs more X-rays. A high-resolution digital flat-panel detector captures this transmission variance to reveal internal structural layouts.
The Spec: Operating at micro-focus tube voltages up to 130 to 160 kV, 3D AXI penetrates dense multi-layer boards to resolve internal defects with a spatial resolution as fine as 2 μm.
The Problem: Electronics manufacturers face a constant trade-off between full-board inspection speed and high-fidelity image quality. Choosing the wrong imaging platform results in either bottlenecked SMT lines or high escape rates for complex packaging defects.
The Science: Line Scan technology utilises fixed X-ray tubes and multiple Time Delay Integration (TDI) line-scan cameras while the PCB moves continuously, capturing synchronised, line-by-line data optimised for rapid full-board scanning. Area Scan (Planar CT) keeps the PCB entirely stationary while the X-ray tube and a Flat Panel Detector rotate physically around the target FOV, capturing a dense cluster of multi-angle views optimised for high-density, selective inspection.
The Spec: Modern automated lines choose based on layout goals; for example, the V810Ai QX1 HS (High Speed) optimises Area Scan cycle times by achieving an acquisition speed of 1.1 seconds per FOV (compared to 1.6 seconds on HR configurations) to significantly bridge the throughput gap.
The Problem: When operators review potential defects on dense boards, standard 3D rendering systems often merge adjacent features or include background noise, making it difficult to clearly see the boundaries of a borderline defect.
The Science: The newer ViTrox QCT (Quality Control Tomography) Software addresses this by introducing dedicated FOV Profiling. This tool sharpens feature contrast and flattens background noise during 3D rendering, allowing the system to extract distinct, clean geometric shapes out of complex structural datasets.
The Spec: QCT delivers distinct joint separation on tightly packed fields of view where older visualisation suites produce incomplete or blurry profiles, giving operators maximum clarity during critical defect verification.
The Problem: Small passives like chip capacitors and resistors frequently generate false missing or offset calls due to slight visual variations in their termination bands. Traditional threshold settings mistake these harmless reflection and texture changes for true anomalies, causing the machine to halt or forcing verification operators to waste time reviewing thousands of good joints.
The Science: AI Intelligent Tuning (specifically part of the AI Programming suite) is designed to target these high-volume passives. Instead of requiring engineers to manually calibrate a dozen different parameters for upper, centre, and lower fillets, the software uses machine learning to automatically analyse profile and thickness data from sample images. It easily recognises harmless physical variations in termination bands and autonomously sets the ideal parameters and threshold configurations without sacrificing true defect detection.
The Spec: Activating AI fine-tuning requires a lean baseline of only 30 good joints per subtype (such as standard Gullwing, QFN, Leadless, J-Lead, or SMT chips). The automated system calculates the parameter configurations in roughly 30 seconds, establishing an accurate data baseline that achieves an overall system testing accuracy of 92.47% with an ultra-low escape rate of 0.33%.
The Problem: Advanced components like High Bandwidth Memory (HBM) and sensitive semiconductor packages can suffer from severe lattice damage or bit-flip errors if exposed to excessive radiation doses during automated X-ray inspection.
The Science: To combat this, physical filter caps made of Aluminium and Zinc are placed over the X-ray tube output. These filters act as high-pass radiation shields, absorbing low-energy, long-wavelength X-ray photons ("soft" radiation) that contribute heavily to component radiation absorption without providing useful imaging data. The filtered beam, consisting of "harder," higher-energy photons, penetrates the package safely to deliver crisp images to the detector.
The Spec: Standard configuration options include combinations like 1mm Al + 0.6mm Zn or 1mm Al + 0.3mm Zn. This hardware filtration configuration keeps maximum component absorption well below the critical safety threshold of <30 mGy (or <3 rad).
The Problem: In fast-moving consumer electronics or high-volume automotive lines, the physical loading and unloading time of a board inside the AXI cabinet creates dead time, causing a line bottleneck.
The Science: Dual-lane systems eliminate this overhead through parallel material handling. While lane 1 contains a stationary board undergoing active multi-angle X-ray scanning, lane 2 concurrently unloads the previously inspected board and indexes the next unit into position. The moment lane 1 completes its scan, the X-ray gantry quickly transitions over to lane 2, achieving near-continuous beam utilisation.
The Spec: Implementing dual-lane transport systems delivers a direct throughput and cycle time optimisation improvement of 20% to 30% compared to single-lane equivalents.
The Problem: Backdrilling removes the unused portion (stub) of a plated through-hole via to minimise signal reflection in high-speed digital boards. If the drill depth is off, the remaining stub creates signal distortion. Because this stub is buried deep within the inner layers of the PCB, it cannot be measured using optical methods.
The Science: 3D AXI provides a non-destructive method to measure these internal features. By taking multi-angle X-ray views across the backdrilled via, the 3D reconstruction software generates a clear vertical cross-section of the internal via structure. The software then automatically identifies the end of the copper plating and the start of the drilled void, measuring the remaining stub length with high precision.
The Spec: The Spec: The automated measurement software detects variations down to the micron level, ensuring that remaining stub lengths are safely kept within tight performance tolerances
The Problem: While high-resolution Planar CT imaging provides excellent defect clarity, standard configurations can cause a line bottleneck if a board contains dozens of dense fields of view (FOVs) that require multiple exposure steps.
The Science: The ViTrox V810Ai QX1 HS (High Speed) platform utilises an upgraded hardware configuration to speed up cycle times. The system pairs a larger, high-frame-rate Flat Panel Detector (FPD) with optimised exposure routines. By expanding the active sensor footprint, the system can reduce the total number of physical FOVs needed to cover the exact same board surface area by half. Additionally, high-speed on-the-fly acquisition mechanics trim the imaging time down for each individual step.
The Spec: The QX1 HS model reduces acquisition times down to a rapid 1.1 seconds per FOV (compared to 1.6 seconds on HR configuration). On a high-density reference board containing multiple switch ASICs and connectors, this slashes full-board cycle times from ~122 seconds down to ~80 seconds without requiring any sacrifice in optical magnification.
The Problem: Advanced packaging configurations utilise miniature Controlled Collapse Chip Connection (C4) bumps (70 μm to 120 μm diameters) to link internal dies. These are buried beneath thick silicon caps or multi-layer interposers, rendering them invisible to optical inspection systems and standard 2D X-ray systems due to severe overlapping geometries.
The Science: The ViTrox V810Ai QX1 platform isolates these internal structures by applying high-energy, high-magnification 3D volumetric slice algorithms. The system maps the precise vertical layers of the advanced package, allowing operators or automated recipes to look at independent slice levels. This separates overlapping geometries cleanly, making it possible to inspect 80 µm C4 bumps and 90 µm copper Through-Silicon Vias (TSVs) for micro-voids, hairline shorts, or delamination.
The Spec: The platform utilises dedicated software algorithms paired with high-resolution configurations to flatten grey levels across dense packages, ensuring reliable defect detection inside complex stacked components
The Problem: Automated Optical Inspection (AOI) functions like a highly advanced human eye—it relies on visible light and top-down or angled cameras to inspect circuit boards. Because it requires a direct line of sight, AOI has a physical limitation: it is completely blind to hidden, non-visible solder joints that sit directly underneath advanced components or heavy physical shielding.
The Science: 3D Automated X-ray Inspection (AXI), such as the ViTrox V810Ai series, utilises high-energy X-ray photons that safely penetrate solid materials based on their physical density. While plastic packages and silicon dies allow X-rays to pass through easily, dense metals like tin and lead in solder joints strongly absorb the energy, casting a crisp geometric silhouette onto a Flat Panel Detector. By rotating the X-ray source and detector around the board using Planar Computed Tomography (Planar CT), the software can mathematically slice through different vertical Z-heights. This separates overlapping top and bottom components with zero physical artifacts, allowing the system to inspect the internal structure of hidden joints.
The Table:
The Spec: While AOI excels at fast cosmetic surface verification, deploying a 3D AXI system guarantees 100% full-stack test coverage. This enables automated algorithms to programmatically measure internal specifications—such as calculating exact QFN thermal pad voiding percentages down to a strict 7.20% false call baseline or auditing through-hole components to meet strict automotive IPC Class 3 rules (requiring >75% vertical solder barrel fill).
The Problem: Automated X-ray Inspection (AXI) machines must run at high sensitivities to ensure zero defect escapes. However, this rigorous testing naturally generates false alarms (false calls) caused by structural shadows, board warpage, or component variations. Manually reviewing and clearing thousands of these images every day introduces severe operator fatigue, leading to inconsistent defect judgements across shifts and lines.
The Science: ViTrox Verification Tool Solution (VVTS) is a dedicated defect verification and analysis workstation that standardises the post-inspection buyoff process. Instead of forcing operators to interact directly with the active machine or look at raw data files, VVTS consolidates defect images and data into a unified interface. When paired with AI VVTS, the system processes a synchronised data packet alongside defect images. The local neural networks perform real-time inference to automatically identify and authorise obvious false calls, reducing the manual review workload to a small fraction of borderline or true structural failures.
The Spec: Implementing an AI-driven VVTS architecture cuts total operator image review times by up to 85%. The automated sorting engine operates at an overall system measurement accuracy of 92.47%, maintaining a false call rate of 7.20% and an escape rate of 0.33% to ensure reliable, standardised manufacturing quality.
The Problem: Even calibrated systems experience micro-drifts due to component age or factory temperature shifts, which can alter measurement accuracy across different shifts
The Science: Systems feed live parametric data into smart ecosystems (like VDSPC 2.0 or V-ONE) where predictive tracking algorithms monitor streaming data for statistical shifts before they violate pass/fail limits
The Spec: If drift is detected, the software triggers localised synchronisation loops to balance joint measurements, maintaining benchmarks like the ~80-second cycle time without manual recalibration
The Problem: Package-on-Package (PoP) architectures stack multiple active dies vertically on top of each other. A standard 2D X-ray combines all the solder levels into a single, confusing image, making it impossible to determine if a micro-void is located in the top memory layer, the middle interposer, or the bottom logic board.
The Science: This layer confusion is solved through true Z-axis image slicing. The ViTrox V810Ai QX1 reconstructs the entire stacked assembly into a high-density 3D data volume. The programming software then maps independent slice heights matching the exact physical positions of each vertical layer, allowing algorithms to analyse the voiding percentages of each ball array independently.
The Spec: This advanced slicing technique successfully inspects miniature features down to 01005 and 008004 form factors, cleanly isolating 80 µm C4 bumps and 90 µm copper TSVs inside stacked configurations.
The Problem: Manually changing detectors or hardware configurations during a line changeover to accommodate different pixel size requirements causes severe manufacturing delays.
The Science: The ViTrox V810Ai QX1 HR addresses this through a software-controlled electronic feature called Binning Mode. Controlled directly within the recipe, Binning Mode mathematically combines adjacent pixels on the high-resolution Flat Panel Detector into larger, single cooperative data pixels, instantly transforming the sensor into a high-frame-rate speed mode without requiring physical hardware changes.
The Spec: This electronic adaptation allows the platform to switch fluidly between high-resolution profiles for advanced components and broad nominal pixel ranges (up to 30 µm) to optimise line throughput based on immediate product requirements.
The Problem: On dual-sided PCBAs, components are mounted on both the top and bottom surfaces directly opposite one another. In a standard 2D top-down X-ray, the top and bottom solder joints overlap completely in the raw image, creating massive visual clutter. This structural masking makes it impossible for standard thresholding programmes to isolate defects, leading to an uncontrollable surge in false alarms or severe defect escapes.
The Science: The ViTrox V810Ai QX1 overcomes this layer confusion entirely through Planar Computed Tomography (Planar CT). By keeping the PCBA completely stationary while rotating the X-ray source and a high-precision Flat Panel Detector (FPD) along an oblique circular path, the hardware captures a dense cluster of multi-angle views. The volumetric reconstruction software then processes this dataset to mathematically slice the board into independent horizontal Z-height layers. This cleanly separates the top-side components from the bottom-side components into distinct, isolated slices, completely eliminating any overlapping visual clutter.
The Spec:A single on-the-fly acquisition sequence generates a complete volumetric dataset, providing independent, automated inspection of both sides of the board simultaneously. This allows the system to check for over 23 preset joint types while maintaining an optimised full-board cycle time of ~80 seconds on the V810Ai QX1 HS platform without needing to physically flip the board.
The Problem: During the high-temperature reflow process, large-footprint packages (such as network switch ASICs or complex substrates) experience uneven thermal expansion, leading to severe package warpage. When a board warps, the physical vertical position (Z-height) of the solder joints shifts across the device. On high-magnification systems with narrow focal planes, this vertical drift causes joints within the same Field of View (FOV) to appear altered in size, distorted, or completely out of focus, leading to severe measurement errors.
The Science: Advanced automated systems address this dynamic variation by deploying Package Warpage Heatmap Analysis combined with laser-guided automated focus adjustments. As the system maps the board, it automatically measures the precise vertical height distribution of the hidden mid-ball layers across the device footprint. The software instantly processes these measurements to dynamically compensate for local Z-axis deviations. Furthermore, this structural data is translated into a colour-coded topological heatmap, giving process engineers full visibility into the exact physical warpage patterns of the board before full mass production begins.
The Spec: Available natively within advanced software suites like QX 1.5, the warpage compensation mechanics eliminate guesswork by using localised heatmap indicators to verify optimal Stencil Openings and Reflow Oven Temperature Profiles. This real-time vertical alignment ensures absolute measurement stability across dense arrays, preventing the inspection slowdowns and cycle-time penalties that older multi-stack image compensation methods typically trigger.
The Problem: Copying an inspection programme between identical machines on different lines usually causes a spike in false alarms due to minor hardware variations, mechanical tolerances, and X-ray tube age.
The Science: The ViTrox V810Ai platform resolves this through intelligent Programme Transferability features. When a recipe is shared with a sister machine, the software runs an automated local synchronisation routine. This routine learns the unique hardware baseline of the new machine and updates the joint nominal values automatically, adjusting the thresholds to align with the new line without forcing an engineer to rewrite the core recipe.
The Spec: This background adjustment process allows recipes to be shared fluidly across an entire global enterprise network, maintaining high detection accuracy without requiring manual machine recalibration.
The Problem: In connectors like Paladin or Examax2, overlapping metal pins merge into an unreadable block in top-down images, making it impossible to verify pin presence or insertion depth.
The Science: True 3D volumetric reconstruction stacks hundreds of angled views to isolate the inner core of individual pins, allowing algorithms to analyse the density profile of the barrel interface while ignoring structural noise.
The Spec: The system provides sub-micron or low-micron resolution (mapping features down to 15 µm to 22 µm), enabling precise measurement of pin insertion depths exceeding 1.5 mm.
The Problem: Implementing custom AI models traditionally requires uploading raw production images and PCB layout files to external cloud servers for labelling and deep learning compilation. For high-security sectors (such as aerospace, medical life support, and military electronics), uploading proprietary data externally is strictly prohibited by compliance regulations.
The Science: The ViTrox AI VVTS Training Platform runs as a fully local software installation deployed directly on factory-side network hardware. Data labelling, model retraining, and verification loops occur completely inside a closed-loop information security environment managed by edge tools like VDSPC 2.0. This architecture guarantees that proprietary CAD data, intellectual property, and defence-related hardware layouts remain protected and completely inaccessible to outside networks.
The Spec: This local closed-loop configuration provides an unrestricted modelling pipeline, empowering factories to train an unlimited number of custom AI models tailored to specific component variances with zero recurring data fees, subscription overhead, or security compliance risks.
The Problem: Automotive inductors often feature large ferrite cores that sit directly over or adjacent to Plated Through-Hole (PTH) solder joints. The massive density of the ferrite core blocks standard X-rays, making it extremely difficult to verify if solder has wicked up the barrel to meet structural regulatory requirements.
The Science: Advanced AXI uses a combined approach of high-power penetration and automated slice height selection. By setting up distinct slice height configurations matching the 50%, 75%, and 100% vertical markers of the PCB barrel, the software calculates the exact volumetric fill of the solder paste within the hole, completely independent of the heavy shadowing cast by the overhead ferrite core.
The Spec: This allows the machine to programmatically audit and guarantee compliance with strict automotive IPC Class 3 requirements, which mandate a minimum of 75% vertical solder barrel fill.
The Problem: The X-ray tube is the core—and most costly—hardware component of an automated X-ray inspection system. Because closed transmissive tubes operate under high thermal stress and extreme electrical voltage, internal filaments and targets experience natural degradation over time. If a tube fails unexpectedly, it triggers immediate line stoppages, un-scheduled engineering downtime, and costly emergency maintenance overhead.
The Science: Hardware reliability is managed through a combination of physical beam filtering and automated software tracking. In the ViTrox V810Ai ecosystem, systems deploy scheduled CD&A (Confirmation, Diagnostic, and Adjustment) routines during line changeovers to monitor grey-level variations and correct for early tube degradation. To prevent premature filament burnout on high-density production runs, the system utilises hardware-level Aluminium (Al) and Zinc (Zn) filter caps. These caps absorb lower-energy, long-wavelength photons ("soft" radiation) that generate excessive heat within the tube housing without contributing to the imaging dataset, ensuring the tube runs cooler during high-penetration cycles.
The Spec: A high-performance closed transmissive X-ray tube running continuously under standard production environments generally delivers an operational lifespan of 5,000 to 10,000 hours before requiring filament servicing or refurbishment. When running high-power modules like heavy IGBT substrates on configurations like the V810Ai QX1 HP (High Power), which runs up to 80 W with currents reaching 500 µA, maintaining automated CD&A validation task schedules ensures absolute measurement stability throughout the tube's entire lifecycle.
The Problem: High-speed network backplane connectors contain hyper-dense rows of thick metal pins. Because these pins overlap tightly in vertical and horizontal space, traditional top-down imaging merges them into an unreadable metal block. This makes it impossible to see if micro-voids have formed inside the internal plated barrel interfaces.
The Science: True 3D volumetric reconstruction resolves this by slicing through independent vertical Z-height sections. The reconstruction software stacks hundreds of angled views to isolate the inner core of individual pins. This allows specialised inspection algorithms to analyse the density profile specifically within the barrel interface, completely ignoring the structural noise from adjacent pins or overhead shielding.
The Spec: The system automatically extracts clear geometric data to check for hidden defects like missing pins, bent pins, or insufficient solder inside highly complex press-fit pin structures.
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