Dynamic Inspection Region Selection
Configurable Defects Categorization
Flexible Metrology
Customizable E-Map Generation
Smart Threshold with Deep Learning
Imaging with High Resolution Camera
Automated & Fast Conversion within 3 Magnification Lenses
Raw Wafer Warpage Handling
Bernoulli Dual Arm Raw Wafer Robot
Intelligent Autofocus Technology
Customized LED Lighting
Wafer Backside Inspection
Raw & Mounted Wafer Loading
SECS/GEM Ready
Data Collection Charting
Yield Optimization by Offline Verifier
Cleanroom Class 100
Wafer Crack
Die Missing
Discoloration
Edge Burr
Edge Debris
Scratch
Crack
Chipping
OCR
Flexible Dimension Measurement