Dynamic Inspection Region Selection
Configurable Defects Categorization
Flexible Metrology
Customizable E-Map Generation
Smart Threshold with Deep Learning
Imaging by 25 Megapixels High Resolution Camera
Automated & Fast Conversion within 3 Magnification Lenses
Raw Wafer Warpage Handling
Bernoulli Dual Arm Raw Wafer Robot
Intelligent Autofocus Technology
Customized LED Lighting
Bottom Vision Inspection
Raw & Mounted Wafer Loading
SECS/GEM Ready
Data Collection Charting
Yield Optimization by Offline Verifier
Color Inspection
Cleanroom Class 10
Wafer Crack
Die Missing
Discoloration
Edge Burr
Edge Debris
Scratch
Crack
Chipping
OCR
Flexible Dimension Measurement