| July 27, 2021 3:00-4:00 pm MYT
With the ever-increasing number of features and ever-decreasing size of die, we are approaching near-zero tolerance to the presence of defects on the wafers. New-unknown defects are being discovered as the wafer technology continues to innovate towards nano-scale direction. These defects should be caught early in order to help identify the causes of these defects in the process and eventually help to improve the yield. We are going to share our defect detection capabilities with the ultimate goal to give you a worry-free production line with improved yield.
What will you learn from this webinar:
In this webinar, you will know how Automated Wafer Inspection (AOI) could benefit your production line in different wafer processes. Generally, there are 2 types of defects for all wafers - random and systematic. The random defects could happen anywhere, while the systematic defects follow some pattern. These two defects are harder to find due to the feature sizes of the chips are becoming smaller. It will be an exciting journey through the wafer fabrication processes, exploring the myriad possibilities in reducing E-waste and improving production yield.
What will you obtain from this webinar:
- Discover the suitable application of Wafer Inspection in multiple wafer processes
- Explore the variety of defect detection technologies available in ViTrox
- Showcase the inspection data trace back and analysis